2003
DOI: 10.1016/s0169-4332(02)01071-1
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Excimer laser crystallization of amorphous silicon carbide produced by ion implantation

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Cited by 16 publications
(9 citation statements)
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“…Nevertheless, a-SiC can be transferred to a metastable liquid similar to Si. The metastable liquid transforms into nc-SiC within the 10-100 ns range [16,17], independent of melt temperature. Large grains cannot be generated in SiC by longer laser pulses.…”
Section: Experimental Results: Other Semiconductorsmentioning
confidence: 99%
“…Nevertheless, a-SiC can be transferred to a metastable liquid similar to Si. The metastable liquid transforms into nc-SiC within the 10-100 ns range [16,17], independent of melt temperature. Large grains cannot be generated in SiC by longer laser pulses.…”
Section: Experimental Results: Other Semiconductorsmentioning
confidence: 99%
“…9 Previous research has shown that the threshold for melting the surface of a-SiC is strongly dependent on the thickness of the amorphous SiC layer. [10][11][12] So, it was unclear whether the strong dependence we observed for the A G threshold on implanted ion species was due to the amorphous surface layer produced by the ion implantation process, or to a catalytic effect due to the implanted ion species (doping), or both. To investigate further, we devised experiments to study these effects separately.…”
Section: Resultsmentioning
confidence: 93%
“…Early studies by Baeri et al used time-resolved reflectivity experiments to determine the minimum laser fluences required from a pulsed Ruby laser to melt a-SiC layers of different thicknesses, produced by Ar þ ion implantation; 10 and related numerical simulations were conducted by Dutto et al 11 and Hedler et al 12 We performed similar calculations for our different experimental conditions. A finite element analysis was used to estimate the surface temperature during the PLA process.…”
Section: Thermal Simulationsmentioning
confidence: 95%
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“…Due to the low diffusivity of the dopant species in the material, the ion-implantation technique is the consolidated method for selective doping in 4H-SiC power electronics devices, such as junction barrier Schottky (JBS) diodes or MOSFETs. , Nonetheless, the ion-implantation process inevitably leads to the production of lattice damage or even amorphization of the material . Hence, postimplantation thermal annealing treatments are conventionally performed in furnaces at high temperature (>1600 °C), to partially recover the crystalline structure of the semiconductor and achieve the electrical activation of the dopant species, bringing them in substitutional lattice sites . However, the electrical activation of the dopant species is limited by both their solid solubility and the attainable annealing temperature in conventional high temperature furnaces.…”
Section: Introductionmentioning
confidence: 99%