Excimer-Laser-Based, Thin Beam Directional 'Xtallization (TDX) and Thin Beam Based LTPS Technology for Processing Large Area Poly-Silicon

Abstract

This paper provides a review of Thin Beam Directional Atallization (TDX) technology and presents the most recent experimental results illustrating the versatility of thin beam based LTPS processes. As the TDX process moves toward full production, these results confirm the viability of using a thin beam for SLS and for micro-ELA processing as alternative, and complementary, operational modes of the TCZ-900X laser annealing tool.