“…Consequently, the choice of ULs for the deposition of AF layer becomes crucial. Accordingly, different materials for AF layer as PtMn [3,8], FeMn [7,10,20,21], IrMn [4][5][6]9,[11][12][13][14][15][16][17][18][19]22,24,25] and different ULs [3][4][5][6][7][8][11][12][13][14][15][16][17][18]21,22] deposited using DC and RF magnetron sputtering (DC-MS, RF-MS) and ion beam sputtering [20] were established. In top EB systems, ULs as Ta/NiFe [6], Ta, Cu or Si [7,13,17,20], Cu, Ru or Cu/ Ru [4,5,15] provides the /1 1 1S texture in AF layer, in bottom type EB systems it was induced by Ta/AuCu [3]<...>…”