We report thermoelectric transport measurements across a graphene/hexagonal boron nitride (h-BN)/graphene heterostructure device. Using an AC lock-in technique, we are able to separate the thermoelectric contribution to the I-V characteristics of these important device structures. The temperature gradient is measured optically using Raman spectroscopy, which enables us to explore thermoelectric transport produced at material interfaces, across length scales of just 1-2 nm. Based on the observed thermoelectric voltage (∆V) and temperature gradient (∆T), a Seebeck coefficient of -99.3 μV/K is ascertained for the heterostructure device. The obtained Seebeck coefficient can be useful for understanding the thermoelectric component in the cross-plane I-V behaviors of emerging 2D heterostructure devices. These results provide an approach to probing thermoelectric energy conversion in two-dimensional layered heterostructures.Electron transport in the cross-plane direction of layered material heterostructures has recently shown interesting new functionalities that extend far beyond lateral graphene devices. Graphene-based heterojunction devices, such as graphene/silicon and graphene/ gallium arsenide diodes, have demonstrated rectifying behavior and gate-tunable photovoltaic responses [1-10] heterostructure devices made by combining graphene with other 2D materials, such as graphene/ hexagonal boron nitride (h-BN)/graphene and graphene/ MoS 2 , have shown interesting electron tunneling transport, negative differential conductance, and light absorption behaviors [11][12][13][14][15]. In addition to electron transport and light absorption in these graphenebased heterojunctions, heat dissipation in these types of devices is found to be dominated by vertical heat transfer [16,17]. Despite the large in-plane thermal conductivity in graphene and h-BN, the cross-plane thermal conductance of single-and few-layer graphene and h-BN can be rather small because of the atomic scale thickness. Hence, heat dissipation from these 2D heterostructure devices are often limited by thermal transport across the graphene/h-BN junction. A recent measurement has shown that the interface Nano Research