2021
DOI: 10.1016/j.jallcom.2021.158627
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Excellent wear resistance of multicomponent nanocrystalline W‒Cu based composite

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Cited by 21 publications
(6 citation statements)
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“…Reproduced with permission. [ 149 ] Copyright 2021, Elsevier B.V. e–g) Scanning electron microscope (SEM) image, elemental distribution, microhardness and electrical conductivity of W–Cu compacts. Reproduced with permission.…”
Section: Homogenous and Inhomogeneous Architecturementioning
confidence: 99%
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“…Reproduced with permission. [ 149 ] Copyright 2021, Elsevier B.V. e–g) Scanning electron microscope (SEM) image, elemental distribution, microhardness and electrical conductivity of W–Cu compacts. Reproduced with permission.…”
Section: Homogenous and Inhomogeneous Architecturementioning
confidence: 99%
“…The homogeneous microstructure architecture hinders crack propagation and creates different crack propagation paths, which in turn improves the plasticity of the samples. [149] Copyright 2021, Elsevier B.V. e-g) Scanning electron microscope (SEM) image, elemental distribution, microhardness and electrical conductivity of W-Cu compacts. Reproduced with permission.…”
Section: Et Al Prepared a W-cu-based Nanocomposite Co-doped Withmentioning
confidence: 99%
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“…However, most studies to date have mainly focused on investigating the hardness and strength of W–Cu composites at room temperature [ 15 , 16 , 17 , 18 , 19 , 20 , 21 ]. For the enhancement of wear resistance and high-temperature strength of W–Cu composites, grain refinement and second-phase strengthening are commonly used methods [ 22 , 23 ]. Owing to the high thermal stability and superior high-temperature properties, WC has attracted much attention as the strengthening phase of conventional W–Cu composites [ 12 , 24 , 25 , 26 ].…”
Section: Introductionmentioning
confidence: 99%
“…Due to the mutual insolubility of W and Cu, powder metallurgy is the most widely used method for almost all composite fabrication, but this method does not guarantee the required density and mechanical properties of the W–Cu alloys [ 25 , 26 , 27 ]. To improve the relative density and wettability of copper and tungsten, a small amount of Co, Ni, Ti, Cr, or Fe is usually added to the W powder as sintering activators [ 28 , 29 , 30 , 31 ]. The isostatic cold pressing of W powder, combined with 1100 °C annealing for 2 h for the tungsten skeleton formation and subsequent copper infiltration at 1350 °C in a hydrogen atmosphere for 90 min, is used for the W–Cu composite fabrication [ 32 ].…”
Section: Introductionmentioning
confidence: 99%