2022
DOI: 10.3390/ma15196700
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Excellent Thermoelectric Performance of 2D CuMN2 (M = Sb, Bi; N = S, Se) at Room Temperature

Abstract: 2D copper-based semiconductors generally possess low lattice thermal conductivity due to their strong anharmonic scattering and quantum confinement effect, making them promising candidate materials in the field of high-performance thermoelectric devices. In this work, we proposed four 2D copper-based materials, namely CuSbS2, CuSbSe2, CuBiS2, and CuBiSe2. Based on the framework of density functional theory and Boltzmann transport equation, we revealed that the monolayers possess high stability and narrow band … Show more

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Cited by 5 publications
(2 citation statements)
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References 64 publications
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“…At a temperature of 543 K, the observed value of power factor is 0.00672 μW cm −1 K −2 . 50 The rise in the power factor with temperature can be attributed to the increased electrical conductivity and Seebeck coefficient. The figure of merit ( zT ) is calculated using the below equation (eqn (7)).where ‘ S ’ denotes the Seebeck coefficient, ‘ σ ’ represents the electrical conductivity, ‘ κ ’ is the thermal conductivity and ‘ T ’ is the temperature.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…At a temperature of 543 K, the observed value of power factor is 0.00672 μW cm −1 K −2 . 50 The rise in the power factor with temperature can be attributed to the increased electrical conductivity and Seebeck coefficient. The figure of merit ( zT ) is calculated using the below equation (eqn (7)).where ‘ S ’ denotes the Seebeck coefficient, ‘ σ ’ represents the electrical conductivity, ‘ κ ’ is the thermal conductivity and ‘ T ’ is the temperature.…”
Section: Resultsmentioning
confidence: 99%
“…At a temperature of 543 K, the observed value of power factor is 0.00672 mW cm À1 K À2 . 50 The rise in the power factor with temperature can be attributed to the increased electrical conductivity and Seebeck coefficient. The figure of merit (zT) is calculated using the below equation (eqn (7)).…”
Section: Materials Advances Papermentioning
confidence: 99%