Examination of natural convection plumes from partially heated PCB plates and estimation of the heat transfer coefficients

Sarvar, F.; Witting, P. A.; Poole, N. J.

doi:10.1007/bf02661633

Cited by 6 publications

(2 citation statements)

References 2 publications

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“…Thermal analysis of electronic packages using finite element method and finite difference method based software had been widely used. Based on study done in literature [3,4], CFD [4] and Sarvar et al [5]. Isothermal surface convection coefficient correlations are used for this thermal analysis because of its better accuracy compared to isoflux surface convection coefficient.…”

Section: Introductionmentioning

confidence: 99%

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Thermal Performance Prediction of QFN Packages using Artificial Neural Network (ANN)

Law¹,

Cheang²,

Tana³

et al. 2006

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium

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The thermal performance of QFN with body sizes ranging from 3mm x 3mm to 9mm x 9mm with various lead counts were modeled on FR4 printed circuit board using a solid model finite element simulation tools (ANSYS). The thermal performance obtained using FEA agrees well with the experiment data (within 12%). A series of data with different package design parameters, PCB thermal balls, powers and ambient temperatures were obtained to train the Artificial Neural Network (ANN). The trained ANN was then used to predict a set of data to be compared with experiment data.The results of ANN's prediction have good agreement with both experiment results (13%) Hence, ANN can become an altemative tool for package level thermal analysis.

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Section: Introductionmentioning

confidence: 99%

“…is the air velocity and L is the length of the flat surface parallel to the direction of air velocity.For radiation heat transfer coefficient: h,.d =eCC(T + T )(Ts + TX )(5) …”

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confidence: 99%