2014
DOI: 10.1016/j.mechmat.2014.03.006
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Evolution of thermal stress in a coating/substrate system during the cooling process of fabrication

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Cited by 30 publications
(16 citation statements)
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“…As reported in the literature, the physical properties of both, the substrate and feedstock used for the coating deposition, have a strong influence on the resulting stress state [78][79][80]. Song et al [79] showed that the magnitude of thermal stress decreases with an increasing preheating temperature of the substrate.…”
Section: Resultsmentioning
confidence: 98%
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“…As reported in the literature, the physical properties of both, the substrate and feedstock used for the coating deposition, have a strong influence on the resulting stress state [78][79][80]. Song et al [79] showed that the magnitude of thermal stress decreases with an increasing preheating temperature of the substrate.…”
Section: Resultsmentioning
confidence: 98%
“…Song et al [79] showed that the magnitude of thermal stress decreases with an increasing preheating temperature of the substrate. Oladijo et al [80] found that a strong link exists between the stress field in the coating and the physical properties of the substrate, as its CTE relative to that of the substrate, plays a significant role.…”
Section: Resultsmentioning
confidence: 99%
“…In spite of their superior performance at RT, there is a risk of cracking and/or degradation for the surface layers at elevated temperatures arising from generated thermal stress which is in addition to the external working stress [2]. Generally thermal stress develops as the result of the mismatch in the thermal expansion coefficients between surface layer and the substrate [3][4][5]. If the thermal expansion coefficient of the substrate is larger than that of the surface layer, it expands more than the surface layer during heating and therefore leads to generation of tensile type thermal stress at elevated temperatures.…”
Section: Introductionmentioning
confidence: 99%
“…Unlike tensile thermal stress, compressive thermal stress is beneficial in retardation of crack initiation and/or propagation at surface layer [3,7]. In this respect, a number of scientific investigations have been made to control the thermal stress by altering the structure of the surface layers (multilayered, gradient and composite nature) formed by deposition techniques [4][5][6][8][9][10][11][12][13]. When thermochemical diffusion processes are of concern, boriding results in the formation of single (Fe 2 B) or dual-phase (Fe 2 BþFeB) surface layers on ferrous alloys depending on the process parameters [14,15].…”
Section: Introductionmentioning
confidence: 99%
“…The above thermal stress models are based on the temperature difference between the initial and final states of the system. Although the thermal stress during cooling process of fabrication has been studied in the previous literature [22], there is no explicit expression for the transient thermal stress in YSZ coating and the shear stress at the edges of YSZ-S interface during the cooling process of fabrication. On the other hand, all the above models have not considered the effects of spray speed of YSZ coating and the convective heat transfer between the YSZ coating and the environment.…”
Section: Introductionmentioning
confidence: 99%