Evolution of the orthorhombic phase and superconductivity in YBa2Cu3O7-x

An investigation of the migration of oxygen deficiencies in the superconductor YBa2Cu3O7δ

“…The powder was compressed into a rectangular piece of approximate size 1 mm x 4 mm x 60 mm and sintered on a MgO plate at 945 "C for 4 h. A second 6 h sintering was carried out after turning the sintered piece upside down and then it was cooled to room temperature in the oven. Oxygen atmosphere treatment of the piece lasted for 1 h at 650 "C and cooling to room temperature took another 3 h. The procedure for preparing the Y-Ba-Cu-0 sample is essentially identical with previous reports (Luo et a1 1987, Lin et al 1988) except that second sintering process was used to obtain a thorough solid state reaction of the whole bulk.…”

The Study of Copper Etching in Acid Solution

“…As thin film transistor liquid-crystal displays TFT-LCDs are developed to sizes larger than 30 inches with higher resolution, lower electrical resistivity and higher resistance to hillock formation are necessary for the interconnections of TFT-LCDs. Copper has received considerable attention as a potential interconnect material because it exhibits intrinsically excellent electromigration resistance and lower resistivity compared to conventional Al and Al alloys [1][2][3]. However, non-availability of a volatile copper compound in the temperature range of dry etching [4] and further process complexity, render it as uneconomical.…”