2014
DOI: 10.1016/j.egypro.2014.08.027
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Evolution of the Charge Carrier Lifetime Characteristics in Crystalline Silicon Wafers During Processing of Heterojunction Solar Cells

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Cited by 11 publications
(10 citation statements)
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“…However, considering the minimum value of τ b =1 ms, we can estimate a lower bound S pass ≥ 5.7 cm/s from the model fit to the data. This lower bound value for bulk lifetimes and the estimated passivated surface recombination velocity range are consistent with other reports 39–41 for n-type HIT silicon.…”
Section: Discussion and Resultssupporting
confidence: 92%
“…However, considering the minimum value of τ b =1 ms, we can estimate a lower bound S pass ≥ 5.7 cm/s from the model fit to the data. This lower bound value for bulk lifetimes and the estimated passivated surface recombination velocity range are consistent with other reports 39–41 for n-type HIT silicon.…”
Section: Discussion and Resultssupporting
confidence: 92%
“…We also observed a low FF when the thickness of the a‐Si 1– x O x :H buffer layer was above 5.0 nm. Conversely, a‐Si:H buffer layers with similar thicknesses are generally used in high‐efficiency a‐Si:H/c‐Si heterojunction solar cells . In this work, we will demonstrate that high V OC and high FF can also be achieved simultaneously by using a stack buffer layer of a‐Si:H/a‐Si 1– x O x :H in the a‐Si 1– x O x :H/c‐Si heterojunction solar cell, where µc‐Si 1– x O x :H was used as its emitter layer.…”
Section: Introductionmentioning
confidence: 77%
“…Photovoltaics has become one of the most important renewable‐energy technologies in recent years. Combining low‐cost thin‐film technology with crystalline silicon (c‐Si) solar cells, silicon heterojunction (SHJ) solar cells have recently received great attention . A high open‐circuit voltage ( V OC ) can be realized in SHJ solar cells as well as an improved high‐temperature performance .…”
Section: Introductionmentioning
confidence: 99%
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“…In the next step, random pyramid textured substrate surfaces were prepared in KOH solution at temperatures of 80 °C using the isopropanol(IPA)-free and, thus, environmentally, safety and health compliant additive Alkatex Zero TM (GP Solar GmbH) [1]. According to previous investigations, optimized values of the depth of saw damage etch (SDE) and of the duration of texture etching were selected to obtain large minority charge carrier lifetimes, low reflection losses, and low recombination losses [1,6]. For the sake of comparison polished Si wafers were prepared and included in the next steps of preparation (denotes as reference samples).…”
Section: Methodsmentioning
confidence: 99%