2001
DOI: 10.1016/s0169-4332(01)00269-0
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Evolution of surface topography of fused silica by ion beam sputtering

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Cited by 95 publications
(63 citation statements)
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“…(e), (f) Early and late time morphologies, as predicted by numerical integration of equation (10). Panels (a), (b) are reproduced from [7], and (c), (d) are taken from [57], all by permission. for 4 h., which is favorably compared in panel (a) of the same figure with the result provided by numerical integration of equation (9).…”
Section: Pattern Formation: Ion-beam Sputteringmentioning
confidence: 99%
See 1 more Smart Citation
“…(e), (f) Early and late time morphologies, as predicted by numerical integration of equation (10). Panels (a), (b) are reproduced from [7], and (c), (d) are taken from [57], all by permission. for 4 h., which is favorably compared in panel (a) of the same figure with the result provided by numerical integration of equation (9).…”
Section: Pattern Formation: Ion-beam Sputteringmentioning
confidence: 99%
“…The wavelength coarsening prior to the stationary state can be perhaps more easily visualized under oblique incidence conditions, when the pattern has a rippled shape. In figures 6(c) and (d) we show two AFM snapshots of the surface dynamics for fused silica undergoing bombardment at oblique incidence [57]. The black arrows represent the projection of the ion beam direction onto the target plane.…”
Section: Pattern Formation: Ion-beam Sputteringmentioning
confidence: 99%
“…Because of the high atomic density of Al, the erosion velocities of Si, Al, and Al 2 O 3 were more or less the same, and SiO 2 displayed the highest erosion velocities. 3 . Therefore, a strong SiO 2 micro-masking effect can be reasonably assumed to be caused by a mixed oxyfluoride, AlO x F y .…”
Section: Discussionmentioning
confidence: 99%
“…Low-energy ion beam sputtering (IBS) is a powerful bottom-up technology for generating diverse self-organized nanostructures, such as ripples and dots on different materials including amorphous SiO 2 [1][2][3][4][5][6][7], single crystalline Si [8][9][10][11][12], Ge [10,13] and Ag [14], as well as compound semiconductors GaSb [15] and InP [16]; the IBS technology offers the potential to achieve high throughput and fabrication of large areas [10,[17][18][19]. Ion beam parameters (species, incidence angle, energy, flux, etc) and substrate parameters (material, temperature, initial surface topography, etc) interact to generate the features of such nanopatterns.…”
Section: Introductionmentioning
confidence: 99%
“…As described in a review article by Valbusa et al [8], subsequently, many groups picked up these investigations-not only with (reactive) ion-beam machines, but also with (reactive) ion etching (RIE). Those investigations were usually not performed with amorphous glass, but rather for semiconductors or even metals [9][10][11][12][13][14][15][16][17][18][19][20][21][22][23]. The phenomenon observed and described in all of these publications is self-organization due to two compensating effects, which together stabilize the surface profile: first a tendency of surface structure shrinkage due to a preferred etch erosion at oblique flanks and secondly diffusion of the eroded particles into the etched depressions 2 Advances in OptoElectronics and adsorption.…”
Section: Introductionmentioning
confidence: 99%