2015
DOI: 10.1016/j.msea.2015.08.068
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Evolution of interfacial structures and creep behavior of Cu/Ta multilayers at room temperature

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Cited by 16 publications
(12 citation statements)
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“…A further decrease of L led to a significant drop of n below the values found for all other cases. Similar trends were also reported for other nano-multilayers combining fcc/hcp [71] and fcc/fcc [72] structures. Such tendency matches well with that exhibited by the hardness (Fig.…”
Section: Indentation Creepsupporting
confidence: 88%
“…A further decrease of L led to a significant drop of n below the values found for all other cases. Similar trends were also reported for other nano-multilayers combining fcc/hcp [71] and fcc/fcc [72] structures. Such tendency matches well with that exhibited by the hardness (Fig.…”
Section: Indentation Creepsupporting
confidence: 88%
“…A sharp decrease can be obviously observed when h is in the range of 5-10 nm. It comes from the phase transformation in Ta layers, which has been reported in our previous work [31]. The strength in Ag/Cu multilayers increases with decreasing h in the range of 5-100 nm and softens at h \ 5 nm, while in Ag/Nb multilayers, the strength increases with decreasing h and shows a sharply rising trend even when h decreases to 1 nm.…”
Section: Resultssupporting
confidence: 74%
“…In our previous works [4,31], we have reported that the tetragonal b-Ta and cubic a-Ta coexist in Ta layers when h [ 5 nm, while only a-Ta forms when h B 5 nm, which may be the reason why the hardness/ strength drops sharply with decreasing h from 10 to 5 nm. In fact, the crystal a-Ta forms at some special sites with straight interface and generates exactly on the neat Cu(111) plane [31]. The selected area electron diffraction (SAED) pattern of the Cu/Ta multilayer with h = 5 nm is shown in the inset of Fig.…”
Section: Resultsmentioning
confidence: 88%
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“…Noted that the applied uniaxial loading would evolve with the deformation, which became a non-uniaxial one as the crack opening increased. (Figure 1d and f), different from the amorphous ribbons observed in Cu/Ta multilayers [15] and Cu-Nb-Ag composite wires [16]. The mismatch between {112} Cu and {110} V planes across the sharp interfaces is calculated to be 30.8%, while the mismatch is calculated to be 48.4% between {113} Cu and {110} ITZ planes across the ITZs, and 3.6% between {110} V and {110} ITZ planes across the ITZs.…”
Section: Experimental Methodsmentioning
confidence: 81%