2016
DOI: 10.1016/j.jcrysgro.2015.12.050
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Evolution of grain structures during directional solidification of silicon wafers

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Cited by 27 publications
(4 citation statements)
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“…A wavy perturbation is introduced into a planar crystal-melt interface, and the perturbation is amplified and results in zigzag facets. The simulation results and phenomena are consistent with the literature of Takuya [24] and experimental observations [3,[34][35][36]. Through the comparison with the literature and experimental observations, the CA simulation can be validated.…”
Section: Validation Of the Simulation Of Faceted Growth By Casupporting
confidence: 83%
“…A wavy perturbation is introduced into a planar crystal-melt interface, and the perturbation is amplified and results in zigzag facets. The simulation results and phenomena are consistent with the literature of Takuya [24] and experimental observations [3,[34][35][36]. Through the comparison with the literature and experimental observations, the CA simulation can be validated.…”
Section: Validation Of the Simulation Of Faceted Growth By Casupporting
confidence: 83%
“…Twinning is a frequently observed and important phenomenon during solidification of multicrystalline silicon (mc-Si) used for solar cells. Twinning usually occurs on the (111) facet grooves and is a major source for the formation of the Σ3 twin boundary. Because the Σ3 twin boundaries are the most electrically inactive CSL (coincidence site lattice) grain boundaries (GBs), and they are often preferred for mc-Si solar cells.…”
Section: Introductionmentioning
confidence: 99%
“…However, the repetition of twinning has important consequences for the final grain structure and distribution of crystallographic orientations [31]. Indeed, the importance of twinning in the development of the grain structure has been highlighted for different solidification processes ranging from directional solidification [82] to ribbon growth [33,83,84]. In the past few years, we studied rather extensively twin formation, growth, and its At the level of the edge facets, the measured maximum undercooling is again always lower than 1 K. However, higher values (ranging from 2 × 10 −1 to 8 × 10 −1 K) compared to the undercooling inside grain boundary grooves are measured at the edges.…”
Section: Twinning During Solidificationmentioning
confidence: 99%
“…However, the repetition of twinning has important consequences for the final grain structure and distribution of crystallographic orientations [31]. Indeed, the importance of twinning in the development of the grain structure has been highlighted for different solidification processes ranging from directional solidification [82] to ribbon growth [33,83,84]. In the past few years, we studied rather extensively twin formation, growth, and its consequences on the final grain structure and defect formation in general [44][45][46]48,50,52,85].…”
Section: Twinning During Solidificationmentioning
confidence: 99%