Evolution of Grain Boundary Character Distribution in Pure Copper during Low-Strain Thermomechanical Processing

Abstract

In order to get optimal grain boundary character distribution (GBCD) and grain boundary properties, thermomechanical processing (TMP) is usually adopted in grain boundary engineering. However, the mechanism behind the TMP treatments and GBCD optimization is still unclear. The present study has conducted a series experiments involving low-strain TMPs to study the relationship between TMP parameters and the behind microstructural evolution. The experimental results indicate that in the scope of low-strain TMP, strain induced boundary migration (SIBM) is the most effective process for GBCD optimization. Besides, SIBM and grain growth would gradually transfer to recrystallization with the increase of pre-deformation level and annealing temperature. Further quasi in-situ EBSD results infer that SBIM is activated locally in some region with high stored energy, and further gradual initiation of SIBM from one region to another contributes to the gradual increase of special boundaries with annealing time.