Evidence of Large Voids in Pure‐Silica‐Zeolite Low‐<i>k</i> Dielectrics Synthesized by Spin‐on of Nanoparticle Suspensions

Eslava, Salvador; Baklanov, Mikhaı̈l R.; Neimark, Alexander V.; Iacopi, Francesca; Kirschhock, Christine; Maex, Karen; Martens, Johan A.

doi:10.1002/adma.200701798

Cited by 36 publications

(49 citation statements)

References 44 publications

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“…The pure silica zeolite single crystals showed simultaneously remarkably high elastic modulus ( E ) and low k values: E = 49.4 GPa and k = 1.78. Eslava et al went further towards high elastic modulus and presented the study concerning pure silica zeolite layers with a bimodal pore size distribution [108]. Such materials are known to exhibit the highest ever reported elastic moduli [109].…”

Section: Low-k Dielectrics For Electronic Devicesmentioning

confidence: 99%

Mesoporous Silica-Based Materials for Electronics-Oriented Applications

et al. 2019

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Electronics, and nanoelectronics in particular, represent one of the most promising branches of technology. The search for novel and more efficient materials seems to be natural here. Thus far, silicon-based devices have been monopolizing this domain. Indeed, it is justified since it allows for significant miniaturization of electronic elements by their densification in integrated circuits. Nevertheless, silicon has some restrictions. Since this material is applied in the bulk form, the miniaturization limit seems to be already reached. Moreover, smaller silicon-based elements (mainly processors) need much more energy and generate significantly more heat than their larger counterparts. In our opinion, the future belongs to nanostructured materials where a proper structure is obtained by means of bottom-up nanotechnology. A great example of a material utilizing nanostructuring is mesoporous silica, which, due to its outstanding properties, can find numerous applications in electronic devices. This focused review is devoted to the application of porous silica-based materials in electronics. We guide the reader through the development and most crucial findings of porous silica from its first synthesis in 1992 to the present. The article describes constant struggle of researchers to find better solutions to supercapacitors, lower the k value or redox-active hybrids while maintaining robust mechanical properties. Finally, the last section refers to ultra-modern applications of silica such as molecular artificial neural networks or super-dense magnetic memory storage.

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Section: Low-k Dielectrics For Electronic Devicesmentioning

confidence: 99%

Mesoporous Silica-Based Materials for Electronics-Oriented Applications

et al. 2019

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“…higher crystallinity), the lower the mechanical properties [143,144] and the bigger the interstitial voids [143,145]. The mechanical properties decrease with increasing crystallinity because there is less amorphous silica to ensure the homogeneity of the film and also because the interstitial volume and size increase as well [143].…”

Section: Silica Zeolitesmentioning

confidence: 99%

“…The mechanical properties decrease with increasing crystallinity because there is less amorphous silica to ensure the homogeneity of the film and also because the interstitial volume and size increase as well [143]. Regarding the last point, it was clearly shown that for silicalite films the pore size and distribution evolve as a function of the crystallization time [143,145]. For crystallization times less than 3-4 days, pores at 0.55 nm (from silicalite) and at 2-5 nm are detected.…”

Section: Silica Zeolitesmentioning

confidence: 99%

“…For crystallization times less than 3-4 days, pores at 0.55 nm (from silicalite) and at 2-5 nm are detected. At longer crystallization times, additional pores in the range of tens of nanometers are formed [143,145]. Furthermore, it has been demonstrated that an increase of crystallinity is accompanied by a growth of the nanocrystal size and a reduction in the relative amount of amorphous silica [146].…”

Section: Silica Zeolitesmentioning

confidence: 99%

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Low‐kMaterials: Recent Advances

Dubois¹,

Volksen²

2012

Advanced Interconnects for ULSI Technology

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“…However, the previously reported zeolite film fabrication techniques have limitations for low‐ k applications. Two different processes have been previously used to prepare low‐ k zeolite films: in situ crystallization and spin‐on deposition of zeolite crystals. In situ crystallization allows for the fabrication of high mechanical strength zeolite films.…”

Section: Introductionmentioning

confidence: 99%

Sub‐Micrometer Zeolite Films on Gold‐Coated Silicon Wafers with Single‐Crystal‐Like Dielectric Constant and Elastic Modulus

Tiriolo

Rangnekar

Zhang

et al. 2017

Adv Funct Materials

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A low-temperature synthesis coupled with mild activation produces zeolite films exhibiting low dielectric constant (low-k) matching the theoretically predicted and experimentally measured values for single crystals. This synthesis and activation method allows for the fabrication of a device consisting of a b-oriented film of the pure-silica zeolite MFI (silicalite-1) supported on a gold-coated silicon wafer. The zeolite seeds are assembled by a manual assembly process and subjected to optimized secondary growth conditions that do not cause corrosion of the gold underlayer, while strongly promoting in-plane growth. The traditional calcination process is replaced with a nonthermal photochemical activation to ensure preservation of an intact gold layer. The dielectric constant (k), obtained through measurement of electrical capacitance in a metal-insulator-metal configuration, highlights the ultralow k ≈ 1.7 of the synthetized films, which is among the lowest values reported for an MFI film. There is large improvement in elastic modulus of the film (E ≈ 54 GPa) over previous reports, potentially allowing for integration into silicon wafer processing technology.

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Evidence of Large Voids in Pure‐Silica‐Zeolite Low‐k Dielectrics Synthesized by Spin‐on of Nanoparticle Suspensions

Cited by 36 publications

References 44 publications

Mesoporous Silica-Based Materials for Electronics-Oriented Applications

Mesoporous Silica-Based Materials for Electronics-Oriented Applications

Low‐kMaterials: Recent Advances

Sub‐Micrometer Zeolite Films on Gold‐Coated Silicon Wafers with Single‐Crystal‐Like Dielectric Constant and Elastic Modulus

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