2021
DOI: 10.1109/tcpmt.2021.3108436
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Evaporation of Ag Nanotwinned Films on Si Substrates With Ion Beam Assistance

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Cited by 6 publications
(3 citation statements)
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“…Similar to the sputtered Ag film, the evaporated Ag film consists of numerous Ag columnar structure with high density of nanotwins stacking on each other. Since formation of columnar nanotwinned structure can be relatively difficult for evaporated Ag films, an additional ion bombardment is applied to the deposited film during evaporation [30]. The effect of ion bombardment during evaporation deposition seems to be accounted for the formation of high density (111)-oriented Ag nanotwins on sapphire substrate.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Similar to the sputtered Ag film, the evaporated Ag film consists of numerous Ag columnar structure with high density of nanotwins stacking on each other. Since formation of columnar nanotwinned structure can be relatively difficult for evaporated Ag films, an additional ion bombardment is applied to the deposited film during evaporation [30]. The effect of ion bombardment during evaporation deposition seems to be accounted for the formation of high density (111)-oriented Ag nanotwins on sapphire substrate.…”
Section: Resultsmentioning
confidence: 99%
“…Although Wang et al [28] and Idrissi et al [24] synthesized a Pd nanotwinned structure on Si substrates by electron beam evaporation, they found that the films exhibited random orientation, and the twin densities are much lower than those of nanotwinned films manufactured by sputtering or electroplating methods. At the same time, Chuang et al has also reported evaporation of Ag nanotwinned films on Si substrates with ion beam assistance [30].…”
Section: Introductionmentioning
confidence: 99%
“…In addition, evaporated film has excellent purity due to the high vacuum condition. Most importantly, the process is relatively cheap as compared with other deposition techniques and is therefore the one most popularly applied for the backside metallization of power IC wafers in industry [11].…”
Section: Introductionmentioning
confidence: 99%