Evaluation of Thermal Crack Propagation in Die-attached Joints Due to Cyclic Energization by Synchrotron Radiation Laminography Monitoring

Ooi, Junya; Mori, Takao; Tsuritani, Hiroyuki; Sayama, Toshihiko; Okamoto, Yoshiyuki; Hoshino, Masato; Uesugi, Kentaro

doi:10.1109/eptc.2018.8654412

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) 2018

DOI: 10.1109/eptc.2018.8654412

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Evaluation of Thermal Crack Propagation in Die-attached Joints Due to Cyclic Energization by Synchrotron Radiation Laminography Monitoring

Junya Ooi

Takao Mori

Hiroyuki Tsuritani

et al.

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Evaluation of Thermal Crack Propagation in Die-attached Joints Due to Cyclic Energization by Synchrotron Radiation Laminography Monitoring

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