Evaluation of the Quality of BGA Solder Balls in FCBGA Packages Subjected to Thermal Cycling Reliability Test Using Laser Ultrasonic Inspection Technique

Reddy, Vishnu V. B.; Ume, I. Charles; Williamson, Jaimal; Sitaraman, Suresh K.

doi:10.1109/tcpmt.2021.3065958

Cited by 8 publications

(5 citation statements)

References 13 publications

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“…Post-processing analyses of SAW data has involved the use of signal processing methods such as local temporal coherence analysis [45], wavelet analysis [46], spectral analysis [47] in the frequency domain, and correlation coefficient analysis [48][49][50][51][52][53][54][55] in the time domain. Infrared thermography thermal images and transient temperature response have also been used to analyze heat conduction for defect detection in [56][57][58][59][60][61][62][63].…”

Section: Other Methodsmentioning

confidence: 99%

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A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing

Alam

Kehtarnavaz

2022

IEEE Access

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Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and dependability in an IC. This paper presents a survey or literature review of the methods used for detecting these defects based on different sensing modalities used including optical, radiological, acoustical, and infrared thermography. A discussion of the detection methods used is provided in this survey. Both conventional and deep learning approaches for detecting die attachment and wire bonding defects are considered along with challenges and future research directions.INDEX TERMS die attachment and wire bonding defects, defect detection in IC manufacturing, integrated circuit (IC) defects

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Section: Other Methodsmentioning

confidence: 99%

“…SAW has been used to identify defects such as missing bumps and cracks in [45][46][47][48][49]50], voids in micro solder bumps in [54,55], underfills in [49], ball interconnections in flip chips and BGA in [51][52][53].…”

Section: Surface Acoustic Waves (Saw)mentioning

confidence: 99%

A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing

Alam

Kehtarnavaz

2022

IEEE Access

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“…Dye and pull tests were held on all samples and BGA components to observe potential solder joint cracks indicators for rework and adjacent BGA components 31 . Initial optical and X-ray inspections were performed on the PCBA samples to determine signs of physical damage or stress on the reworked and adjacent components.…”

Section: Methodsmentioning

confidence: 99%

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

Ismail

Bakar

Ehsan

et al. 2022

Sci Rep

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This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly. Three types of heat shield placement locations were used: sample X, individual heat shield placement on adjacent components of the rework location; sample Y, a U-shaped, and sample Z, a square-shaped heat shield placed respectively at the heat source location. The dye and pull test results, infrared thermography, and temperature measurements were analysed to understand the relationship between the location of the heat shield and solder joint damage during rework. Heat shield placement at the heat source location on the reworked component can reduce the peak temperatures on the adjacent rework component locations by up to 8.18%. The peak temperatures of the centre and corner of the BGA component can be maintained below 195 °C and 210 °C, respectively to improve the adjacent rework component locations' solder joint quality by reducing solder joint damage by more than 50% solder cracks. This is useful for thermal management during rework involving high-density ball grid array component placements on double-sided printed circuit board assembly.

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“…Presently, SiP and SoP have been effectively fulfilled using various advanced packaging technologies in a two-dimensional (2D) planar, two-and-a-half dimensional (2.5D) [3,4], or three-dimensional (3D) IC packaging configuration [5], such as package-in-package (PiP) [4], package-on-package (PoP) [6,7] using flip chip chip-scale packaging (FCCSP) [8,9], and flip chip ball grid array (FCBGA) packaging [10], and 3D IC integration with through silicon vias (TSVs) silicon or glass interposers [3,4,11,12]. When fulfilling these HI packaging technologies, high-density interconnect (HDI) IC substrates and interposers play a crucial role in providing electrical connection between the IC chip and the printed circuit board (PCB) and mechanical support and heat dissipation for IC chips.…”

Section: Introductionmentioning

confidence: 99%

“…In addition, they play a dominant and essential role in the thermomechanical behavior of the electronic assemblies, driven by the mismatch between temperature and the coefficient of thermal expansion (CTE) among the constituent materials. Presently, many studies have been carried out to assess the thermal performance, reliability, and warpage of various laminate substrate-based IC packages and assemblies (see, e.g., [1][2][3][4]7,9,10,13]). Normally, this can be achieved using direct detailed finite element analysis (DD-FEA).…”

Section: Introductionmentioning

confidence: 99%

Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging

Cheng,

Jhu

2023

Materials

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Laminate substrates in advanced IC packages serve as not only the principal heat dissipation pathway but also the critical component governing the thermomechanical performance of advanced packaging technologies. A solid and profound grasp of their thermomechanical properties is of crucial importance to better understand IC packages’ thermomechanical behavior. This study attempts to introduce a subregion homogenization modeling framework for effectively and efficiently modeling and characterizing the equivalent thermomechanical behavior of large-scale and high-density laminate substrates comprising the non-uniform distribution and non-unidirectional orientation of tiny metal traces. This framework incorporates subregion modeling, trace mapping and modeling, and finite element analysis (FEA)-based effective modeling. In addition, the laminates are macroscopically described as elastic orthotropic or elastic anisotropic material. This framework is first validated with simple uniaxial tensile and thermomechanical test simulations, and the calculation results associated with these two effective material models are compared with each other, as well as with those of two existing mixture models, and direct the detailed FEA. This framework is further tested on the prediction of the process-induced warpage of a flip chip chip-scale package, and the results are compared against the measurement data and the results of the whole-domain modeling-based effective approach and two existing mixture models.

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Evaluation of the Quality of BGA Solder Balls in FCBGA Packages Subjected to Thermal Cycling Reliability Test Using Laser Ultrasonic Inspection Technique

Cited by 8 publications

References 13 publications

A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing

A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging

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