Evaluation of physical and mechanical properties of particleboard made from Petung bamboo using sucrose-based adhesive

Abstract

Bamboo is a potential non-wood lignocellulosic material from which to make particleboard. Sucrose-based adhesive is another potential ingredient, but its use in particleboard has been limited. Addition of ammonium dihydrogen phosphate (ADP) can be used to increase the bonding ability of sucrose-based adhesive and to reduce the required pressing temperature. Therefore, this research used different pressing temperatures and sucrose/ammonium dihydrogen phosphate (ADP) composition ratios to optimize the properties of particleboards. The physical and mechanical properties of the boards were analyzed and compared with the JIS A 5908 (2003) standard for particleboard. The results showed that the interaction of the sucrose-ADP composition ratio and the pressing temperature significantly affected the physical and mechanical properties of the particleboards. The particleboard using only sucrose as adhesive had optimum properties at 200 °C; however, after addition of ADP, the intended properties could be achieved at a 160 °C pressing temperature.

Application of maltodextrin-based adhesive on particleboard made from Salacca frond

“…However, further addition (20 wt% ADP) had similar IBS values compared to 10 wt% ADP. This result was similar to Zhao et al (2018) and Widyorini (2020), but the effect of increasing pressing temperatures from 180 and 200 °C to 220 °C in the sucrose/ADP (85/15 wt%) particleboard did not increase the IBS value remarkably. As mentioned above, the curing mechanism of maltodextrin-based adhesive was expected to be related to caramelization and the forming of furan-type compounds/furan derivative, i.e.…”

“…Therefore, the lowest TS and WA values of maltodextrin-based particleboard was achieved at higher catalyst contents and pressing temperatures, i.e. 20 wt% at 220 °C, while the same TS value could be achieved at 180 °C for sucrose-based particleboard (Widyorini 2020).…”

“…(Umemura et al 2003;Moubarik et al 2009;Lei et al 2010;Umemura et al 2011;Bertaud et al 2012;Kollman et al 2012;Norstrom et al 2014;Widyorini et al 2016). Recently, Umemura et al (2017) found that sucrose/ADP (ammonium dihydrogen phosphate) is a promising wood adhesive because of its bonding ability and high-water resistance, as also reported by Zhao et al (2018) and Widyorini (2020). Sucrose is abundant and available everywhere, but it is widely used as the main sugar in food and drinks, and its usage for commercial wood adhesives may experience obstacles.…”

“…Santoso et al (2017) states that the thickness swelling (TS) of nipa frond particleboard with 20 wt% maltodextrin does not meet the Japanese industrial standard (JIS) A 5908 ( 2003) for particleboard at both 180 and 200 °C pressing temperatures but meets the standard only after a minimum 12.5 wt% addition of cross linker citric acid. In addition, Zhao et al (2018) and Widyorini (2020) have successfully improved properties of recycled wood particleboard and bamboo particleboard, respectively, by addition of ADP.…”

Polymer Composite Fabrication Reinforced with Bamboo Fiber for Particle Board Product Raw Material Application

“…Research on the use of bamboo particles to meet the mechanical and physical characteristics of the particleboard aligned with the industry standards is ongoing. A number of studies are currently evaluating the effects of varying percentages and sizes of bamboo particles, as well as the factor of additives between the fiber and the matrix, and the type of matrix and fiber [32][33][34][35].…”