Evaluation of methods to counteract multipactor phenomena in X-band waveguides

Abstract

This study investigates multipactor mitigation techniques in X-band geometries, focusing on surface modifications, surface conditioning, and additive manufacturing. Surface modifications include geometric alterations such as dimpled surfaces. Experimental results demonstrate that 3D-printed copper test pieces can achieve a multipactor onset threshold comparable to traditionally machined test pieces with appropriate sample preparation. Surface conditioning, involving rapid successions of pulses, is explored for its mitigative potential. Among assessed techniques, dimpled configurations demonstrated superior multipactor hold-off compared to non-modified components. Additionally, the conditioning of test pieces significantly increased the single-pulse threshold.