Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform

Heo, Min-Haeng; Seo, Young-Jin; Yoon, Jeong-Won

doi:10.1007/s10854-024-13132-z

J Mater Sci: Mater Electron

2024

DOI: 10.1007/s10854-024-13132-z

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Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform

Min-Haeng Heo,

Young-Jin Seo,

Jeong-Won Yoon

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Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform

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References 30 publications

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