Evaluation of Heat Transfer Rate of Double-Layered Heat Sink Cooling System With High Energy Dissipation

Abstract

The present work evaluates thermal exchange through a double-layered mini-channel heat sink used as a cooling system for electronic components. Different factors influencing heat exchange enhancement were investigated using ANSYS-Fluent<sup>©</sup> software, which enables the simulation of the fluid flow and heat transfer. The evaluation of thermal exchange between the cold fluid and heated solid with high thermal dissipation has been accurately analyzed under the effect of system geometry, fluid nature, and cooling system material. The numerical outcomes demonstrated that the heat transfer quality significantly increases with the variation of the system shape, where the cooling system presented a significant reduction of average temperature by around 62%-65%. In addition, using pure water as the system coolant improved the heat transfer rate by about 42%-47% for different Reynolds number values by comparing it with ethylene glycol. Concerning the cooling system materials, the selection of the materials depends on the analysis of their thermal properties with the evolution of temperature and thermal exchange. Therefore, using copper as a cooling material improves the overall performance of a cooling system, delivering higher efficiency and performance.