2016
DOI: 10.1016/j.jmatprotec.2015.11.003
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Evaluation of grinding-induced subsurface damage in optical glass BK7

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Cited by 109 publications
(21 citation statements)
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“…They ignored the effect of cutting speed on machining-induced damage. Li et al [6] studied the effect of grinding wheel speed and workpiece feed rate on SSD of the BK7 glass, shown in Eq. 7, where λ is related to the material properties of the workpiece and the geometric shape of the grains; v w is the workpiece velocity; L is the spacing between the successive cutting edges; v s , a, and are the speed, the depth of cut, and the diameter of the wheel.…”
Section: Predictive Methodsmentioning
confidence: 99%
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“…They ignored the effect of cutting speed on machining-induced damage. Li et al [6] studied the effect of grinding wheel speed and workpiece feed rate on SSD of the BK7 glass, shown in Eq. 7, where λ is related to the material properties of the workpiece and the geometric shape of the grains; v w is the workpiece velocity; L is the spacing between the successive cutting edges; v s , a, and are the speed, the depth of cut, and the diameter of the wheel.…”
Section: Predictive Methodsmentioning
confidence: 99%
“…Hard and brittle materials are widely used because of their excellent physical and mechanical properties, such as high hardness and strength at elevated temperatures, wear and corrosion resistances, etc. Among hard and brittle materials, single crystalline silicon is the predominant substrate material for integrated circuits (IC) [1][2][3][4][5]; optical glasses are for optical windows and lens [6][7][8][9][10][11] as well as high-power laser components [12]; ceramic materials are commonly used for bearings, cutting tools and machine parts [13][14][15][16]. However, these materials are also difficult to machine due to their hard and brittle nature.…”
Section: Introductionmentioning
confidence: 99%
“…Brittle fracture of glass takes place due to the formation of micro-cracks when the applied cutting force exceeds the strength of glass. In this situation, median cracks perpendicular to the feed direction and lateral cracks parallel to feed direction are generated [47][48][49]. Median cracks travel deeper into the material responsible for strength degradation and subsurface damage (SSD), resulting in the removal of bigger chunks.…”
Section: Microstructure Analysismentioning
confidence: 99%
“…Fused silica optics are typically prepared by cutting followed by grinding to near‐net shape and then finishing with a fine abrasive (eg, ceria [CeO 2 ] particles) or chemical etchant . The damage left by conventional cutting and grinding extend below the surface to subsurface damage layers as deep as 300 µm . These surface and subsurface cracks have been shown to act as laser‐energy concentrators .…”
Section: Introductionmentioning
confidence: 99%