Evaluation of Cu-Ti dissimilar interface characteristics for wire arc additive manufacturing process

Abstract

Purpose The purpose of this research is to show the characteristics of a Cu–Ti dissimilar interface produced by a wire arc-based additive manufacturing process. The purpose of this research was to determine the viability of the Cu–Ti interface for the fabrication of functionally graded structures (FGS) using the wire arc additive manufacturing (WAAM) process. Design/methodology/approach This paper used the WAAM process with variable current vis-à-vis heat input to demonstrate multiple Ti-6Al-4V (Ti64) and C11000 dissimilar fabrications. The hardness and microstructure of the dissimilar interfaces were investigated thoroughly. The formation of Cu–Ti intermetallic at the Ti64/Cu fusion interface is been revealed by scanning electron microscopy and energy dispersive X-ray analysis, while X-ray diffraction was used to identify various Cu–Ti intermetallic phases. The effect of microstructure on interfacial sensitivity and hardness are also investigated. Findings The formation of CuTi intermetallic and the β-phase transformation in Ti-6Al-4V are found to be heat input dependent. The Cu diffusion length increases as the heat input for Ti64 deposition increases, resulting in a greater Cu–Ti intermetallic thickness. The Cu–Ti interface properties improve when the heat input is less than approximately 250 J/mm or the deposition current is less than 90 A. The microhardness ranges from 55 to 650 HV from the Cu-side to the interface and from 650 to 350 HV from the interface to the Ti-side. Higher current increases interface hardness, which increases brittleness and makes the interface more prone to interfacial cracking. Originality/value Nonlinear components are needed for a variety of extreme engineering applications, which can be met by FGS with varying microstructure, composition and properties. FGS produced using the WAAM process is a novel concept that requires further investigation. Despite numerous studies on Ti-clad Cu, information on Cu–Ti interface characteristics is lacking. Furthermore, the suitability of the WAAM process for the development of Cu–Ti FGS is unknown. As a result, the goal of this research article is to fill these gaps by providing preliminary information on the feasibility of developing Cu–Ti FGS via the WAAM process.

Non-transferring arc and wire additive manufacturing: microstructure, mechanical properties and bulk texture evolution of deposits

“…Heat input is the prime controllable factor for penetration depth and dilution (Sarathchandra et al , 2020; Yin et al , 2020). WFS primarily decides the flow of arc current, which controls the heat input and wire melting rate (Mishra et al , 2023; Rodrigues et al , 2021; Wang et al , 2022). Under high WFS, current flow enhances the heat input and filler wire melting rate.…”

Influence of copper interlayer on the interface characteristics of stainless steel–aluminium transitional structure in wire arc directed energy deposition

“…The X-ray diffraction (XRD) technique were used to analyse the different phases formed at the interfaces of as-deposited wall. The dissimilar interfaces are found to be very critical due to formation of IMCs and unpredictable metallurgical and mechanical behaviour (Chen et al , 2020; Dharmendra et al , 2020; Mishra et al , 2022; Raj Paul et al , 2023; Senthil et al , 2021). Therefore, during all the metallurgical and mechanical analysis, the area of interest was abridged to the dissimilar interfaces, i.e.…”

“…In addition, the interlayer can act as a stress sink, absorbing all the thermal stresses that develop at the interface, thereby maintaining its strength and integrity. Aligning with the scope, Mishra et al (2022) has used the CuSi material as interlayer between Ni718 and Ti64 alloys via WA-DED process. The authors reported the successful use of Cu as an interlayer between two highly dissimilar materials, as it was able to accommodate interfacial thermal stress while preventing the formation of detrimental IMCs at the interface.…”

Influence mechanism of copper interlayer on the interface bonding during wire and laser additive repair of TA1/Q235 bimetallic sheets

“…Additionally, copper has good toughness and low hardness, significantly avoiding the occurrence of cracks in the repair process. 27 At the copper-Q235 interface, there exists a combination of Cu (s, s) and Fe (s, s), 28,29 while at the copper-TA1 base metal interface, a small number of Cu-Ti compounds can be found. In the titanium-steel contact region, a limited metallurgical reaction occurs, leading to the formation of Fe-Ti compounds in small quantities.…”