2021 10th International IEEE/EMBS Conference on Neural Engineering (NER) 2021
DOI: 10.1109/ner49283.2021.9441072
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Evaluation of Commercial Connectors for Active Neural Implants

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Cited by 2 publications
(1 citation statement)
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“…Furthermore, encapsulation can be time-consuming and complex, hindering widespread adoption. The use of commercially available encapsulation materials is characterized by complex encapsulation processes, such as mixing or drying [ 44 , 45 , 46 ]. Uniform film-type encapsulation with a waterproofing effect and self-bonding properties that can be easily applied to resolve these problems is required.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, encapsulation can be time-consuming and complex, hindering widespread adoption. The use of commercially available encapsulation materials is characterized by complex encapsulation processes, such as mixing or drying [ 44 , 45 , 46 ]. Uniform film-type encapsulation with a waterproofing effect and self-bonding properties that can be easily applied to resolve these problems is required.…”
Section: Introductionmentioning
confidence: 99%