Evaluation of Coatings Applied to Flexible Substrates to Enhance Quality of Ink Jet Printed Silver Nano-Particle Structures

Interfacial toughening of solution processed Ag nanoparticle thin films by organic residuals

“…These nanoparticles were uniformly dispersed in the solvent with a low viscosity (10-17 cP) for printed electronics applications and the surface tension of nanoparticle ink was 35-38 mN m −1 . The nanoparticle is encapsulated by a polymer shell that was revealed in other work as polyvinylpyrrolidone (PVP) [29,30], as was also confirmed by our Fourier transform infrared spectroscopy (FT-IR) analysis shown in figure S2 of the supplemental materials (available at stacks.iop.org/Nano/23/ 485704/mmedia). The PVP shell is expected to melt and form organic residuals on the surface of the silicon substrate by thermal annealing at temperatures above 150 • C, because the melting temperature of PVP is 150-180 • C. Then, the silver nanoparticle film was sintered in a convection oven at 150 • C for 30 min to remove the solvent and to form a solid silver thin film.…”

Versatile Molecular Silver Ink Platform for Printed Flexible Electronics

“…As printed electronics evolves, there is also increasing interest in using screen printing to produce features with a higher resolution and pitch to enable production-scale manufacturing of more complex devices such as transistors, frequency-selective surfaces, and low-band-pass filters . Although it is possible to produce fine lines (<100 μm width) on rigid substrates via screen printing, , it remains a challenge to reliably screen print features with line widths <100 μm on plastic substrates in production using traditional screen printing processes without taking extraneous measures such as the use of coated specialty substrates or carrying out surface chemistry on the screen mesh . This limits the implementation of higher-density flex circuits and the use of additive processes in printed wiring board (PWB) fabrication as a means of replacing lithography and subtractive processes .…”

Characteristics of nanosilver ink (UTDAg) microdroplets and lines on polyimide during inkjet printing at high stage velocity

“…Changjae et al 7 printed low-resistance lines of nanosilver ink on treated polyimide films. Henrik et al 8 evaluated two types of surface treatments to increase the quality of inkjet printed uniform nanosilver lines on polyimide and polyethene substrates. Chia et al 9 used a drop on demand printer to deposit lines of nanosilver ink on polyimide substrates with a drop spacing from 20 mm to 40 mm.…”