Evaluation of Chemical Bonding States in Multilayer Interconnect Structures for Thermal Management in Next Generation Very Large Scale Integration

Abstract

1. Background and purpose Currently, it is expected that Ru is going to be introduced in place of Cu, which is the mainstream interconnect material in the very large scale integrated (VLSI) circuit. As high integration has been proceeding, the interconnect is expected not only having excellent electrical characteristics and reliability, but also providing an effective pathway for the removal of the heat generated by device operation [1]. The increasing current density in the narrowing interconnect produces Joule heat. The generated heat is removed by a heat sink attached to the substrate through the interconnect. Therefore, if the thermal resistance between the substrate and the interconnect is high, the heat cannot be removed efficiently and the interconnect temperature rises, lead to a degradation of VLSI reliability [2].In this study, we evaluated chemical bonding states of Ru/TaN/(SiOx/)Si stacking structure to clarify the mechanism contributing thermal resistance for the superior thermal management in VLSI. 2. Experimental method A 5 nm TaN was deposited by reactive sputtering (Deposition conditions: 25°C, 300 W, 1.0×10-5 Pa, Ta target) and subsequently 10 nm Ru was deposited by magnetron sputtering on a Si substrate with approximately 2 nm-thick native oxide. We prepared four samples with Ar:N2 gas ratios of 19:1, 17:3, 16:4, and 15:5, respectively, during the TaN deposition. The total thermal resistance was measured by the Frequency Domain Thermoreflectance (FDTR) method under vacuum condition.We also evaluated the chemical bonding states at the interface by Laboratory Hard X-ray Photoelectron Spectroscopy (Lab. HAXPES). The measurement conditions were kinetic energy of 9.25 keV, energy resolution of 0.5 eV, energy step of 50 meV, beam diameter of 50 μm2, and detectable depth of 50 nm, respectively. Au 4f was used as a reference of the energy calibration during for the analysis. 3. Results and Discussion The thermal resistance measured from the entire Ru/TaN/(SiOx/)Si stacking structure was reported by previous studies [1]. It can be seen that the thermal resistance decreases with the increase of N2 flow rate. In order to discuss the mechanism for determination of the thermal conductance, we performed nondestructive measurements by Lab. HAXPES.Figures 1 and 2 show the photoelectron spectra obtained from Ru 3d (Ar:N2=19:1, 15:5) and Si 1s (Ar:N2=19:1, 15:5), respectively. From Fig. 1, no significant change is observed in Ru 3d spectra even within the N2 gas flow rate changes. Therefore, the cause of the change in thermal resistance with the N2 gas flow rate change cannot be found at the Ru/TaN interface. On the other hand, from the Si 1s spectrum shown in Fig. 2, it can be confirmed that the peak intensity due to Si-N or Si-O-N bonds increases with increasing N2 gas flow rate. Therefore, it can be considered that the Si-N or Si-O-N bonds formed at the TaN/(SiOx/)Si interface as the N2 gas flow rate increased promoted heat transport and contributed to the reduction of thermal resistance.In summary, the impor...