Evaluating the effect of shock absorber layers in the dynamic behavior of PWB with viscoelastic insert

Pagliosa, Cleber; Neto, João Morais da Silva

doi:10.1109/esime.2010.5464609

Cited by 4 publications

(2 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The results were used to model the reliability of embedded systems. Pagliosa et al [7] have numerically evaluated the use of viscoelastic layers to reduce the stress level on printed circuit boards under dynamic loads. A comprehensive test methodology was developed in [8] in order to evaluate PCB reliability with on-board active components, under thermo-mechanical loads.…”

Section: Introductionmentioning

confidence: 99%

Numerical modelling and optimization of an electronic system embedded in multi-layered viscoelastic materials under shock loads

Alsakarneh

Moore

Barrett

2011

2011 12th Intl. Conf. On Thermal, Mechanical &Amp; Multi-Physics Simulation and Experiments in Microelectronics and Microsystem

View full text Add to dashboard Cite

Presented here is the use and optimization of mutli-Iayer viscoelastic buffer materials to protect embedded electronic systems from high mechanical forces such as impacts. The test vehicle was a solid sports ball, Figure 1. The embedded system was first encapsulated using standard epoxy encapsulant, then further encapsulated with two different buffer materials (a soft and a hard rubber) before the entire system was embedded in the ball. The ball (from the Irish game of hurling) has an original polyurethane/cork core encased in a leather outer skin and is 70 mm. in diameter and weighs 11 Og. The multi-layer buffering system reduces the imposed stress on the epoxy-encapsulated embedded system, so that the stress transmitted to the electronics is significantly reduced. From this point of view, the stress experienced at the embedded system edge was taken as the objective function to be minimized within the overall constraint that the modified ball must closely retain its original size, weight and "bounce" i.e. its Coefficient of Restitution (CoR). This is a specific example of the more general embedded systems problem of embedding, say, a system such as a wireless sensor node in a material or structure without significantly changing the material or structure mechanical properties and reliability. A numerical model, using ANSYS 11.0, was developed and used in a simulation-based designed experiment of eight runs. The element SOLlD92 was used to . m ? del the plastic and electronic structures. The optImIzed multilayered structure reduced the stress on the embedded system by 50% in comparison to the original un-buffered structure and reduced stress by 25% in comparison to the non-optimized buffer system. The optimized structure was within 90% of the original one for weight and 85 % for CoR. This work has defined a design methodology for buffer layers that significantly increase the protection of embedded electronic systems from high mechanical forces without major impact on the host object mechanical properties. The methodology is particularly applicable to the mechanical design of smart objects and structures.

show abstract

Section: Introductionmentioning

confidence: 99%

Numerical modelling and optimization of an electronic system embedded in multi-layered viscoelastic materials under shock loads

Alsakarneh

Moore

Barrett

2011

2011 12th Intl. Conf. On Thermal, Mechanical &Amp; Multi-Physics Simulation and Experiments in Microelectronics and Microsystem

View full text Add to dashboard Cite

show abstract

“…In view of the characteristics of high-load impact during penetration, some scholars have adopted isolation measures to cushion protection measures. [10] and [11] found through finite element numerical simulation that viscoelastic polymer materials have a significant attenuation effect on stress as cushioning materials under impact loading. [12] used carbon fiber epoxy resin as a support plate to isolate electronic devices from the projectile, reducing stress and overload on the electronic devices during launch overload.…”

Section: Introductionmentioning

confidence: 99%

Analysis of the influence of different initial velocities on dynamic performance of multi-layer hard target penetration process

Liu,

Li,

et al. 2023

Front. Phys.

View full text Add to dashboard Cite

To determine the overload characteristics of the internal system of a fuze that penetrates multilayer hard targets using different fixed-link structures, a finite element model consisting of two fixed-link structures (a compression screw and a body screw) is adopted in this paper to simulate the penetration process of a three-layer concrete target plate with corresponding initial velocities. The peak amplification coefficient and vibration coefficient are used to analyze the time-domain characteristics of the penetration process signal during segmented analysis. The extracted acceleration signals of the projectile and sensor are processed by fast Fourier transform to obtain the frequency spectrum analysis results. The simulation results show that under the same working conditions, the sensor’s ability to amplify the peak acceleration of the projectile is 17.77% higher for the body screw fixed-link structure, and the average vibration coefficient is also 9.55% higher. Compared with that of the body screw fixed-link structure, the performance of the compression screw fixed-link structure is better under different initial velocity conditions. The initial penetration velocity affects mainly the amplitude of each frequency corresponding to the acceleration signals of the two fixed-link fuze structure projectiles and sensors while having a relatively small influence on the frequency distribution position.

show abstract

Study on the mechanism of buffer absorbing energy of double-layer heterostructure based on viscoelastic materials for MEMS devices

Feng,

Shi,

Zhao

et al. 2023

Sensors and Actuators A: Physical

View full text Add to dashboard Cite

Evaluating the effect of shock absorber layers in the dynamic behavior of PWB with viscoelastic insert

Cited by 4 publications

References 2 publications

Numerical modelling and optimization of an electronic system embedded in multi-layered viscoelastic materials under shock loads

Numerical modelling and optimization of an electronic system embedded in multi-layered viscoelastic materials under shock loads

Analysis of the influence of different initial velocities on dynamic performance of multi-layer hard target penetration process

Study on the mechanism of buffer absorbing energy of double-layer heterostructure based on viscoelastic materials for MEMS devices

Contact Info

Product

Resources

About