EUV reflectometry and scatterometry for thin layer and periodic structure characterization
Tao Shen,
Iacopo Mochi,
Paolo Ansuinelli
et al.
Abstract:Non-destructive nano-metrology is a fundamental tool for semiconductor device manufacturing. Practically, a combination of several metrology techniques is needed throughout the fabrication process of semiconductor chips, from EUV photomask inspection to patterned wafer metrology. EUV light not only facilitates the production of smaller features in lithography but also emerges as a powerful approach for the metrology required to characterize and analyze these intricate features in future technology nodes, thank… Show more
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