EUV and e-beam manufacturability

Chang, Yao-Wen; Liu, Ru-Gun; Fang, Shao-Yun

doi:10.1145/2744769.2747925

Cited by 13 publications

(2 citation statements)

References 32 publications

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“…With the shift to extreme ultraviolet (EUV) lithography [59] and gate-all-around FETs [60], the "minimax problem" of maximizing chip yields, minimizing manufacturing costs, and maximizing chip performance has grown increasingly complex. Chiplets [61,62] have emerged as a way to address these issues, while also integrating multiple functions in a single package.…”

Section: Semiconductor Shiftsmentioning

confidence: 99%

Reinventing High Performance Computing: Challenges and Opportunities

Reed¹,

Gannon²,

Dongarra³

2022

Preprint

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The world of computing is in rapid transition, now dominated by a world of smartphones and cloud services, with profound implications for the future of advanced scientific computing. Simply put, highperformance computing (HPC) is at an important inflection point. For the last 60 years, the world's fastest supercomputers were almost exclusively produced in the United States on behalf of scientific research in the national laboratories. Change is now in the wind. While costs now stretch the limits of U.S. government funding for advanced computing, Japan and China are now leaders in the bespoke HPC systems funded by government mandates. Meanwhile, the global semiconductor shortage and political battles surrounding fabrication facilities affect everyone. However, another, perhaps even deeper, fundamental change has occurred. The major cloud vendors have invested in global networks of massive scale systems that dwarf today's HPC systems. Driven by the computing demands of AI, these cloud systems are increasingly built using custom semiconductors, reducing the financial leverage of traditional computing vendors. These cloud systems are now breaking barriers in game playing and computer vision, reshaping how we think about the nature of scientific computation. Building the next generation of leading edge HPC systems will require rethinking many fundamentals and historical approaches by embracing end-to-end co-design; custom hardware configurations and packaging; large-scale prototyping, as was common thirty years ago; and collaborative partnerships with the dominant computing ecosystem companies, smartphone and cloud computing vendors.

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Section: Semiconductor Shiftsmentioning

confidence: 99%

Reinventing High Performance Computing: Challenges and Opportunities

Reed¹,

Gannon²,

Dongarra³

2022

Preprint

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show abstract

“…[ 15 ] However, conventional UV lithography shows its limit down to 1 µm scale structures, while expensive and time‐consuming processes like extreme UV (EUV) or electron beam lithography (EBL) are needed to achieve structures within the nanometer range. [ 16 ] Bottom‐up methods show high yield for producing nanoscale structures with low cost. However, the structural repeatability and facile process of device integration still need to be improved.…”

Section: Introductionmentioning

confidence: 99%

Wafer‐Scale Gold Nanomesh via Nanotransfer Printing toward a Cost‐Efficient Multiplex Sensing Platform

Gao

Zhao

et al. 2023

Adv Materials Technologies

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detect chemical and biological substances toward various application scenarios such as wearable electronics, intelligent pointof-care (POC) diagnosis, environmental monitoring, etc. [1,2] To meet those emerging requirements properly, ideal biochemical sensors should possess properties such as high sensitivity, long-term robustness, fast response, real-time monitoring capability, excellent selectivity, low unit cost, lower limit of detection, wide dynamic range, low power consumption, etc. [3] However, human beings still need a journey of steep climbing to achieve these goals. Notably, the global pandemic of coronavirus disease 2019 (Covid-19) exposed that our technology reserve is not well prepared in meeting such urgent, massive and versatile requirement, and aroused tremendous attention on biochemical sensing technologies.To date, several major technology routes, including chemoresistive, [4,5] plasmonic, [6,7] electrochemical, [8,9] acoustic sensors, [10,11] etc. have been developed and each of those sensors shows specific merits on certain abovementioned aspects toward various real application scenarios. The rapid development of nanofabrication technologies for different materials and various structures has dramatically enhanced the performance of those sensing devices due to their small features and active structural properties such as high surface-to-volume ratios, unique physical properties, etc. [12][13][14] Multiplex sensing platforms via large-scale and cost-efficient fabrication processes for detecting biological and chemical substance are essential for many applications such as intelligent diagnosis, environmental monitoring, etc. For the past decades, the performance of those sensors has been significantly improved by the rapid development of nanofabrication technologies. However, facile processes with cost-effectiveness and large-scale throughput still present challenges. Nano-transfer printing together with the imprinting process shows potential for the efficient fabrication of 100 nm structures. Herein, a wafer-scale gold nanomesh (AuNM) structure on glass substrates with 100 nm scale features via nano-imprinting and secondary transfer printing technology is reported. Furthermore, potential sensing applications are demonstrated towards biochemical substance detection by using AuNM structures as highly responsive substrates for achieving the surface enhanced Raman spectroscopy (SERS), and as working electrodes of electrochemical analysisfor the detection of metallic ions. In the SERS detection mode, different nucleotides can be detected down to 1 nm level and distinguished via theirunique fingerprint patterns. As for electrochemical analysis mode, Pb 2+ ions can be detected out of other interfering components with concentration down to 30 nm. These multimodal sensing mechanisms provide complementary informationand pave the way for low-cost and high-performance sensing platforms.

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Discrete relaxation method for contact layer decomposition of DSA with triple patterning

Chen

Wang

2018

Integration

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EUV and e-beam manufacturability

Cited by 13 publications

References 32 publications

Reinventing High Performance Computing: Challenges and Opportunities

Reinventing High Performance Computing: Challenges and Opportunities

Wafer‐Scale Gold Nanomesh via Nanotransfer Printing toward a Cost‐Efficient Multiplex Sensing Platform

Discrete relaxation method for contact layer decomposition of DSA with triple patterning

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