Eu³⁺ complex/polyimide nanocomposites: Improvement in mechanical and thermal properties

Abstract

A series of Eu 3ϩ -doped polyimide nanocomposites were successfully prepared via the solution process. X-ray diffraction, differential scanning calorimetric analysis, thermogravimetric analysis, transmission electron microscopic analysis, universal testing, and ellipsometry were used to characterize the nanocomposites. TEM results indicated that rare earth particles were homogeneously dispersed in the polyimide matrix with a size of about 20 nm. The introduction of the rare earth complex led to an increase in the glass transition temperature, thermal stability, size stability, and a marked increase in the tensile strength and storage modulus. The addition of the rare earth complex also increased the refractive index of the nanocomposites.

Studies on composites formed by europium complexes with different ligands and polyvinylpyrrolidone

“…7 F 2 transitions. The coordination of CMO of PVP to Eu 3 + ions in the composites of PVP with Eu-h-diketonates cannot be excluded completely, though we do not get any convinced information from FTIR spectra, because it is very popular for CMO group in Nd 3 + /PMMA [14], EuL 3 (H 2 O) in polyimide (L: pyridine carboxylic acid) [15] and in the ureasil containing Eu(CF 3 SO 3 ) 3 [16].…”

Polyimide‐silica nanocomposites exhibiting low thermal expansion coefficient and water absorption from surface‐modified silica

“…As can be seen, the CTE value of the PISA film was decreased with increasing the SiO 2 -OA-1 content, from 27.3 ppm/8C for pure PI to 15.9 ppm/8C (42% lowering) and 15.1 ppm/8C (45% lowering) for PISA-5 and PISA-9, respectively, while that of the PISI film was not significantly lowered by addition of the pristine SiO 2 . The effective lowering of CTE for the PISA film is ascribed to the nano-size of the SiO 2 -OA-1 particles and well dispersion in the PI matrix 11,13 as well as the inherently low CTE of the SiO 2 network (about 0.5 ppm/8C), which obstructed the expansion of polymer chains when the temperature is raised. In addition, as reported by Japp and Poliks 28 a CTE close to that of the adhered metal foil, which is 17 ppm/8C for the copper foil, is required to reduce the stress on a solder joint.…”

“…[1][2][3][4][5] However, most polyimides exhibit relatively high water absorption and coefficients of thermal expansion (CTE) (about 25-50 Â 10 À6 K À1 ) 6 and limit their applications for advanced electronic products. 2,[7][8][9][10] Therefore, many studies of PI/inorganicfiller composites, which included PI/oxo-metal nanocomposites, 11,12 PI/metal-complex nanocomposites, 13 PI/organo-clay nanocomposites, [14][15][16][17] PI/silica nanocomposites, [18][19][20][21][22][23][24] etc., have been studied. Among them, most of the PI/silica nanocomposites reported have been prepared via the sol-gel process, where silica nanoparticles were formed in the polyimide matrices via hydrolysis and polycondensation from the organic-silanes.…”

Influences of compositions and ligands on photoluminescent properties of Eu(III) ions in composite europium complex/PMMA systems

“…Although it is difficult to deduce the exact coordination sphere around Eu 3+ ions in the species with higher molar ratios, it is possible that the CQO group coordinates to Eu 3+ ion, in other words, one H 2 O is replaced by a CQO group. The interactions between CQO groups and lanthanide ions are very popular in solid-doped systems such as in the composite systems of Nd 3+ /PMMA [70], EuL 3 (H 2 O) 2 in polyimide (L: pyridine carboxylic acid) [71] and in the ureasil containing Eu(CF 3 SO 3 ) 3 [63]. FTIR spectra of these systems supply related informations on the coordinate interaction [52].…”