1976
DOI: 10.1063/1.323096
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Etch pits and dislocations of Ga1−xAlxAs liquid phase epitaxial layers

Abstract: The etch pits of Ga1−xAlxAs are revealed by the etchant (H2O/H2O2/CH3COOH/HF) and it is verified that these etch pits correspond faithfully to dislocations using x-ray transmission topographs. The shapes of dislocation etch pits which are revealed by the etchant (1 H2O/1 H2O2/2 CH3COOH/0.5 HF) are either conical on the (100) face of Ga1−xAlxAs with x≳0.1 or pyramidal on the (100) face of Ga1−xAlxAs with x=0.05.

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Cited by 12 publications
(5 citation statements)
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“…Recently, the composition and width of the SiO2-Si interface, formed by thermal oxidation of <10O> and <111> oriented Si surfaces were characterized by analysis of x-ray photoelectron spectroscopy (XPS) data (5)(6)(7)(8). Changes in Si chemical bonding at this interfacial region were derived from XPS spectra (5,8).…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Recently, the composition and width of the SiO2-Si interface, formed by thermal oxidation of <10O> and <111> oriented Si surfaces were characterized by analysis of x-ray photoelectron spectroscopy (XPS) data (5)(6)(7)(8). Changes in Si chemical bonding at this interfacial region were derived from XPS spectra (5,8).…”
Section: Introductionmentioning
confidence: 99%
“…Recently, the composition and width of the SiO2-Si interface, formed by thermal oxidation of <10O> and <111> oriented Si surfaces were characterized by analysis of x-ray photoelectron spectroscopy (XPS) data (5)(6)(7)(8). Changes in Si chemical bonding at this interfacial region were derived from XPS spectra (5,8). Although the detection limit of x-ray photoelectron spectroscopy is approximately 1013 cm -2 and does not provide a means for direct observation of the sites responsible for Qss, the XPS findings do provide a new picture of the transition region within which these electrical instabilities must be understood.…”
Section: Introductionmentioning
confidence: 99%
“…The depth resolution is estimated to be about 5% of the sputtered film thickness, or 50A for the typical 1000A oxide films. The secondary ion yields of C1 + in SiO2 are less than a factor of 3 greater than in silicon, while the sputter rates in Si and SiO2 differ by not more'than 10% under these measurement conditions (12). No evidence for charging effects on the C1 species due to the sputter etcn proceaure was indicated.…”
Section: Methodsmentioning
confidence: 76%
“…The characteristics of the samples are summarized in Table I, where melt-back of the substrate has been employed for sample II by a temperature rise of 3.8~ X-ray topographs are obtained under conditions of anomalous transmission (#t : 12-14) by a double crystal Lang technique using monochromatic divergent radiation made by a curved (111) Ge crystal (10). Cu-Kal radiation and Ilford L4 50 It has been reported that the etchant (H20/H202/ CH~COOH/HF) is a dislocation etchant for Gal-xAlzAs epitaxial layers (12). Molten KOH is a good dislocation etchant for (001) GaAs (13,14).…”
Section: Experiments and Resultsmentioning
confidence: 98%
“…Although the examination for dark spots was unsuccessful, the application of a defect-revealing etchant for dislocations was a most fruitful enterprise. There are a variety of etchants that produce dislocation etch pits in (100) GaAs, among which are the ammonium hydroxide anodic (AHA) etchant ( 9), the A-B etchant (10), an iodine-based etchant (11), and the H202-HF-acetic acid etchant (12). The etchant used in this study, however, was molten KOH, first suggested by Grabmaier and Watson (13).…”
Section: Device Fabrication and Dislocation Measurement Techniquesmentioning
confidence: 99%