Estimation of Paris-Erdogan law parameters and the influence of environmental factors on crack growth

Newby, MJ Martin

doi:10.1016/0142-1123(91)90356-4

Cited by 9 publications

(6 citation statements)

References 10 publications

(3 reference statements)

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“…Van Noortwijk [18] determined optimal maintenance policies for sea defenses; fatigue crack growth in pressure vessels and in aircraft structures has been described by Sobczyk [15] and Newby [8,9]; optimal inspection and maintenance policies for degradation processes are studied by Newby and Dagg [10,11] and that study forms the main background to the developments described here. Similar approaches are used in epidemiology: Jewell and Kalbfleisch [6] use marker processes in the study of CD4 counts in HIV infected patients; Betensky [3] used Wiener process models in designing sequential tests for differences in treatment effect of drugs.…”

Section: Motivational Backgroundmentioning

confidence: 98%

A bivariate process model for maintenance and inspection planning

Newby

Barker

2006

International Journal of Pressure Vessels and Piping

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Section: Motivational Backgroundmentioning

confidence: 98%

A bivariate process model for maintenance and inspection planning

Newby

Barker

2006

International Journal of Pressure Vessels and Piping

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“…Paris & Erdogan formulated a power law which is commonly used to model stable fatigue crack growth [63]:…”

Section: Fatigue Life Prediction Of Solder Jointsmentioning

confidence: 99%

“…Where ∆J is the J integral range corresponding to equation 16, while C ′ and m ′ are constants [62][63][64][65].…”

Section: Fatigue Life Prediction Of Solder Jointsmentioning

confidence: 99%

Solder joint failures under thermo-mechanical loading conditions – A review

Depiver

Mallik

Harmanto

2020

Advances in Materials and Processing Technologies

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Solder joints play a critical role in electronic devices by providing electrical, mechanical and thermal interconnections. These miniature joints are also the weakest links in an electronic device. Under severe thermal and mechanical loadings, solder joints could fail in 'tensile fracture' due to stress overloading, 'fatigue failure' because of the application of cyclical stress and 'creep failure' due to a permanent long-term load. This paper reviews the literature on solder joint failures under thermo-mechanical loading conditions, with a particular emphasis on fatigue and creep failures. Literature reviews mainly focused on commonly used lead-free Sn-Ag-Cu (SAC) solders. Based on literature in experimental and simulation studies on solder joints, it was found that fatigue failures are widely induced by accelerated thermal cycling (ATC). During ATC, the mismatch in coefficients of thermal expansion (CTE) between different elements of electronics assembly contributes significantly to induce thermal stresses on solder joints. The fatigue life of solder joints is predicted based on phenomenological fatigue models that utilise materials properties as inputs. A comparative study of 14 different fatigue life prediction models is presented with their relative advantages, scope and limitations. Creep failures in solder joints, on the other hand, are commonly induced through isothermal ageing. A critical review of various creep models is presented. Many of these strain ratebased creep models are routed to very well-known Anand Model of inelastic strain rate. Finally, the paper outlined the combined effect of creep and fatigue on solder joint failure.

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“…the related parameter values can be estimated through regression models using degradation and/or failure data. For example, the physics equations of the fatigue cracking of the seal are built according to Paris-Erdogan law (Newby, 1991), which relates the stress intensity factor range to the crack growth under a fatigue stress regime; the values of the parameters are estimated through least squares regression methods by using data on crack length and cycles. The values of the third group can be estimated using related degradation and/or failure data obtained from historical field collection or shock tests (Chan and Englert, 2001), using likelihood-based inference or regression models (Ye , et al, 2011).…”

Section: Pdmps For Systems Subject To Degradation Dependency and Random Shocksmentioning

confidence: 99%

Reliability assessment of systems subject to dependent degradation processes and random shocks

Lin

Zio

2016

IIE Transactions

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System failures can be induced either by internal degradation mechanisms or by external causes. In this article, we consider the reliability of systems experiencing both degradation and random shock processes. The dependencies between degradation processes and random shocks and those among the degradation processes are explicitly modeled. The degradation processes of system components are modeled using Multi-State Models (MSMs) and Physics-Based Models (PBMs). The piecewise-deterministic Markov process modeling framework is employed to combine MSMs and PBMs and to incorporate degradation and random shocks dependencies. The Monte Carlo simulation and finite-volume methods are used to compute the system reliability. A subsystem of a residual heat removal system in a nuclear power plant is considered as an illustrative case

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Estimation of Paris-Erdogan law parameters and the influence of environmental factors on crack growth

Cited by 9 publications

References 10 publications

A bivariate process model for maintenance and inspection planning

A bivariate process model for maintenance and inspection planning

Solder joint failures under thermo-mechanical loading conditions – A review

Reliability assessment of systems subject to dependent degradation processes and random shocks

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