Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards

Silveira, Joao Vitor Thomsen; Li, Zidi; Fushinobu, Kazuyoshi; Yasui, Ryuta; Shinoda, Takeshi

doi:10.1109/tcpmt.2022.3143507

Cited by 3 publications

(1 citation statement)

References 16 publications

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“…Validation by infrared thermography confirmed the heat dissipation of the components in the PCBA samples during rework 18 . Warmer temperatures, where more heat and infrared radiation are emitted, are indicated by brighter colours (red, orange, and yellow), while cooler temperatures are indicated by purple and dark blue or black where less heat and infrared radiation are emitted 19 .…”

Section: Resultsmentioning

confidence: 72%

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

Ismail

Bakar

Ehsan

et al. 2022

Sci Rep

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This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly. Three types of heat shield placement locations were used: sample X, individual heat shield placement on adjacent components of the rework location; sample Y, a U-shaped, and sample Z, a square-shaped heat shield placed respectively at the heat source location. The dye and pull test results, infrared thermography, and temperature measurements were analysed to understand the relationship between the location of the heat shield and solder joint damage during rework. Heat shield placement at the heat source location on the reworked component can reduce the peak temperatures on the adjacent rework component locations by up to 8.18%. The peak temperatures of the centre and corner of the BGA component can be maintained below 195 °C and 210 °C, respectively to improve the adjacent rework component locations' solder joint quality by reducing solder joint damage by more than 50% solder cracks. This is useful for thermal management during rework involving high-density ball grid array component placements on double-sided printed circuit board assembly.

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Section: Resultsmentioning

confidence: 72%