Estimating burn-in fall-out for redundant memory

Barnett, T.S.; Singh, A.D.; Nelson, Victor P.

doi:10.1109/test.2001.966650

Cited by 8 publications

(3 citation statements)

References 14 publications

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“…This paper bas validated the integrated yield-reliability model for redundant memory first presented in [4]. Data from both SRAM and DRAM memory chips has demonstrated that chips that have been repaired are more likely to fail stress tests than chips with no repairs.…”

Section: Discussionmentioning

confidence: 67%

“…It will be shown that the yield-reliability model for redundant memory, first presented in [4], can accurately predict the number of strcss test failures. In particular, chips that have been repaired are more likely to fail stress tests than chips with no repairs.…”

Section: Itc International Test Conferencementioning

confidence: 99%

“…In this section the integrated yield-reliability model presented in [4] will be briefly reviewed. The model is based on the fact that the same defects that cause wafer probe failures also cause early-life reliability failures (e.g.…”

Section: Defect Typesmentioning

confidence: 99%

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Redundancy implications for early-life reliability: experimental verification of an integrated yield-reliability model

Barnett

Grady

Purdy

et al.

Proceedings. International Test Conference

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This papcr validates an integrated yield-reliability model for redundant memory using yield and stress test data from a 36 Mbit SR.AM memory chip and an 8 Mbit embedded DRAM chip. These products were manufactured by IBM Microelectronics in Burlington, Vermont. In both cases, those chips determined functional following wafer test and repair were subjected to voltage stress and burn-in. It will be shown that the yield-reliability model can accurately model not only the fraction of die with 0 , 1 , 2 , . . . repairs, but also predict the number of stress test failures for a die with a given number of repairs. Because defects in integrated circuits tend to cluster, it has been suspected that repaired die have a greater chance of containing early-life reliability defects than die with no repairs. Repaired die should therefore be more likely to fail stress tests than die with no repairs. This work presents the first experimental validation of these statements. In particular, experimental results indicate that, as predicted by the yield-reliability model, the stress test failure probability is linearly related to the number of repairs; the slope of this line is intimately related to the degree to which defects cluster over the wafer. Model predictions are in excellent agreement with observed data.

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Section: Discussionmentioning

confidence: 67%

Section: Itc International Test Conferencementioning

confidence: 99%