Establishing the relationship between process, structure, and properties on titanium nitride films deposited by electron cyclotron resonance assisted reactive sputtering. II. A process model

Abstract

Articles you may be interested inEffect of oxygen incorporation on structural and properties of Ti-Si-N nanocomposite coatings deposited by reactive unbalanced magnetron sputtering J. Vac. Sci. Technol. A 24, 974 (2006); 10.1116/1.2202128 Structure and mechanical properties of Ti-Si-N films deposited by combined DC/RF reactive unbalanced magnetron sputtering Establishing the relationship between process, structure, and properties of TiN films deposited by electron cyclotron resonance assisted reactive sputtering. I. Variations in hardness and roughness as a function of process parametersResearch has been conducted to investigate ways to make thinner, yet more cohesive TiN films. Physical vapor deposition techniques were used in conjunction with electron cyclotron resonance to deposit TiN films on substrates of Inconel 718. This investigation has focused on the relationship between film deposition parameter interactions, and the resulting film microstructure and mechanical response. Previous parts of this investigation have quantified the differences in Meyer hardness and grain orientation of these deposited TiN films as a function of systematically varied deposition conditions. This part of the research develops a model that explores the connection between deposition conditions, film texture, and mechanical integrity. This model describes the relationship between the triad of ͑1͒ deposition conditions, ͑2͒ texture metrics that include fractal exponent, crystal orientation, and grain size, and ͑3͒ mechanical response, as measured by Meyer hardness and root-mean-square roughness.