Essential reformulations for optimization of highly conductive inserts embedded into a rectangular chip exposed to a uniform heat flux

Abstract

Optimization of a highly conductive insert embedded into a heated rectangular chip has been lately investigated. The role of the insert was to gather the heat current within the chip body and remove it to a minimum temperature heat sink. The central goal of this paper is to invoke several reconsiderations, which result in excessive reduction of the peak temperature in the heated chip in comparison with the lowest peak temperature existed in the archival literature. It is proved that for the configuration under study with its bottom surface receiving a heat flux, the branching patterns of the insert must be avoided, in case the appropriate revisions in the architecture (width, location and cross section area) of the simple branchless patterns are considered. An analytical solution for predicting the peak temperatures in the chip is also addressed. It is demonstrated that under the same volume fraction and thermal conductivity of the cooling insert, the peak temperature is reduced to 2.9℃, which is 94% below the lowest temperature existed in the archival literature, which was around 50℃.

Response surface method optimization of innovative fin structure for expediting discharging process in latent heat thermal energy storage system containing nano-enhanced phase change material

“…They reported a wide range of optimal solutions which allows the user to choose the best design parameters. Hajmohammad et al [30] performed a research related to a highly conductive insert embedded into a chip with uniform heat flux at the bottom surface. They proposed reconsiderations for the system condition to reduce the peak temperature and reported 94% reduction in comparison with the previous study.…”

Numerical Simulation and Validation of Thermoeletric Generator Based Self-Cooling System with Airflow

“…These research include, for example, heat transfer in TEG [21,22], thermal analysis of circuit boards [23], airflows in finned heat sinks [24,25], and general hydrodynamics of diffusive processes [26]. Recent advances also include optimal designs and optimization methods, as well as cooling designs with multi-scale techniques [27][28][29][30][31][32][33]. For the investigations of TEG itself, either materials or performance, recent research also include those reported in references [34][35][36][37][38].…”

Estimation of parameters in a fin with temperature-dependent thermal conductivity and radiation

“…For highly conductive inserts embedded in a rectangular-shaped chip and duct, Hajmohammadi et al also carried out various optimization analyses. 30,31 Towards heat transfer enhancement, recently, highly conductive routes and inverted fins are becoming popular and relevant optimization studies for such systems have been reported in many studies. [32][33][34][35] As compared to the deterministic methods, the convergence of the evolutionary/stochastic methods although relatively slow due to elimination of computing gradients, 36 it is noticed that stochastic/ evolutionary-based optimization algorithms posses several advantages.…”

“…also carried out various optimization analyses. 30,31 Towards heat transfer enhancement, recently, highly conductive routes and inverted fins are becoming popular and relevant optimization studies for such systems have been reported in many studies. 32–35…”