Abstract:Copper complexes formed in the interlayer between the thiokol-epoxy adhesive anda brass substrate were studied by electron spin echo envelope modulation. The goal of the study was to help gain better understanding of the nature of the adhesion mechanism of polymer macromolecules with the brass substrate. Previous investigations revealed that square-planar copper complexes with sulphur-containing ligands form in the interlayer. However, a detailed structure of the copper-sulphur complex was not known. To get st… Show more
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