2015
DOI: 10.1016/j.microrel.2015.06.019
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ESD characterization of multi-finger RF nMOSFET transistors by TLP and transient interferometric mapping technique

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Cited by 3 publications
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“…In these papers the high electric field in the oxide and the high temperature increase are addressed as the failure cause. However, in the field of power semiconductor devices, only few works deal with ESD capability [14,15] and only a recent work regards the ESD capability for 200 V FRED diodes [16]. …”
Section: Esd Failuresmentioning
confidence: 99%
“…In these papers the high electric field in the oxide and the high temperature increase are addressed as the failure cause. However, in the field of power semiconductor devices, only few works deal with ESD capability [14,15] and only a recent work regards the ESD capability for 200 V FRED diodes [16]. …”
Section: Esd Failuresmentioning
confidence: 99%