Erratum to: Design principles and considerations for the ‘ideal’ silicon piezoresistive pressure sensor: a focused review

Kumar, Sanjeev; Pant, B. D.

doi:10.1007/s00542-014-2289-2

Cited by 14 publications

(17 citation statements)

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“…According to the comparison between Figure 7 and Figure 9 , the finite element deformation nephogram of the silicon cup bottom is consistent with that of the analytical solution of Matlab software, and the deflection increases gradually from the surrounding to the center, and the deflection is the largest at the center of the silicon cup bottom [ 43 ]. The maximum deflection error of the two methods is within 18%.…”

Section: Finite Element Analysis Of Silicon Bottomsupporting

confidence: 54%

Design, Analysis and Experiment of a Tactile Force Sensor for Underwater Dexterous Hand Intelligent Grasping

Zhang

Liu

Gao

et al. 2018

Sensors

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This paper proposes a novel underwater dexterous hand structure whose fingertip is equipped with underwater tactile force sensor (UTFS) array to realize the grasping sample location determination and force perception. The measurement structure, theoretical analysis, prototype development and experimental verification of the UTFS are purposefully studied in order to achieve accurate measurement under huge water pressure influence. The UTFS is designed as capsule shape type with differential pressure structure, and the external water pressure signal is separately transmitted to the silicon cup bottom which is considered to be an elastomer with four strain elements distribution through the upper and lower flexible contacts and the silicone oil filled in the upper and lower cavities of UTFS. The external tactile force information can be obtained by the vector superposition between the upper and lower of silicon cup bottom to counteract the water pressure influence. The analytical solution of deformation and stress of the bottom of the square silicon cup bottom is analyzed with the use of elasticity and shell theory, and compared with the Finite Element Analysis results, which provides theoretical support for the distribution design of four strain elements at the bottom of the silicon cup. At last, the UTFS zero drift experiment without force applying under different water depths, the output of the standard force applying under different water depth and the test of the standard force applying under conditions of different 0 ∘C–30 ∘C temperature with 0.1 m water depth are carried out to verify the performance of the sensor. The experiments show that the UTFS has a high linearity and sensitivity, and which has a regular zero drift and temperature drift which can be eliminated by calibration algorithm.

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Section: Finite Element Analysis Of Silicon Bottomsupporting

confidence: 54%

Design, Analysis and Experiment of a Tactile Force Sensor for Underwater Dexterous Hand Intelligent Grasping

Zhang

Liu

Gao

et al. 2018

Sensors

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“…Manometers, diaphragms and bourdon tubes were the first class of measuring pressure instruments, and were based on converting the magnitude of the applied pressure to a mechanical deflection of an indicator [5]. Technological progress led to the appearance of new pressure measurement devices in which the externally applied pressure (input pressure) is directly converted into an electrical output signal; these transmitters types are called mechanical-electrical transducers [5,6]. It should be noted that in the present paper the terms, "sensor", "transmitter" and "transducer" are used interchangeably, given the integrated nature of industrial pressure products.…”

Section: Introductionmentioning

confidence: 99%

“…Today, many different types of pressure sensors are utilized, including tenso or piezo-resistive (also called strain gauge) [3][4][5][6][7], piezoelectric [8,9], capacitive [3,4], resonant [10,11] and optical fiber [12,13]. Each pressure sensor type is based on a physical property such as resistance, capacitance, electrical charge, etc.…”

Section: Introductionmentioning

confidence: 99%

Modelling Fluid Loss Faults in an Industrial Pressure Sensor

Soltani

Bushuev

Tugova

et al. 2020

2020 Global Smart Industry Conference (GloSIC)

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The efficient operation of industrial processes requires the timely and accurate diagnosis of faults in process equipment, particularly sensors, as acting on faulty measurement data can result in inefficient or dangerous operation. A common fault mode in industrial pressure sensors is mechanical damage resulting in the leakage of the internal oil (used to transmit external pressure to the sensing element) and the development of an air pocket within the device. In previous work, we have experimentally determined the faulty measurement characteristics of a commercial pressure sensor, where the sensor manufacturer has provided modified sensors with calibrated degrees of oil loss. The current paper develops a mathematical model of this tensoresistive pressure sensor, which describes and explains the impact that oil loss, and hence the presence of an air pocket, has on the static measurement response.

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“…This mechanism has been widely studied over the last 50 years, where the mechanical properties of single crystal Si [5][6][7] and its piezoresistive properties at different doping concentrations [8][9][10][11][12] have been well established. Enhanced models, which account for both the anisotropy of Si and thermal effects on the piezoresistivity, have also been recently published [13][14][15][16][17][18][19]. This provides an excellent basis for initial sensor design, but cannot be solely relied upon to accurately predict the output of a complete pressure sensor.…”

Section: Introductionmentioning

confidence: 99%

Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor

Hamid

Hutt

Whalley

et al. 2020

Sensors

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Piezoresistive silicon pressure sensor samples were thermally cycled after being consecutively packaged to three different levels. These started with the absolute minimum to allow measurement of the output and with each subsequent level incorporating additional packaging elements within the build. Fitting the data to a mathematical function was necessary both to correct for any testing uncertainties within the pressure and temperature controllers, and to enable the identification and quantification of any hysteresis. Without being subjected to any previous thermal preconditioning, the sensors were characterized over three different temperature ranges and for multiple cycles, in order to determine the relative contributions of each packaging level toward thermal hysteresis. After reaching a stabilised hysteretic behaviour, 88.5% of the thermal hysteresis was determined to be related to the bond pads and wire bonds, which is likely to be due to the large thermal mismatch between the silicon and bond pad metallisation. The fluid-fill and isolation membrane contributed just 7.2% of the total hysteresis and the remaining 4.3% was related to the adhesive used for attachment of the sensing element to the housing. This novel sequential packaging evaluation methodology is independent of sensor design and is useful in identifying those packaging elements contributing the most to hysteresis.

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Erratum to: Design principles and considerations for the ‘ideal’ silicon piezoresistive pressure sensor: a focused review

Cited by 14 publications

References 0 publications

Design, Analysis and Experiment of a Tactile Force Sensor for Underwater Dexterous Hand Intelligent Grasping

Design, Analysis and Experiment of a Tactile Force Sensor for Underwater Dexterous Hand Intelligent Grasping

Modelling Fluid Loss Faults in an Industrial Pressure Sensor

Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor

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