2014 IEEE 18th Workshop on Signal and Power Integrity (SPI) 2014
DOI: 10.1109/sapiw.2014.6844556
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Equivalent circuit model of the IC-Stripline coupling to IC package

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Cited by 5 publications
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“…All the simulations as well as the IC stripline structure are simulated using 3D EM solver. Hwang et al [47] has followed the methodology but improvised model proposed in [48] Heuvelman et al [49] this concept is extended and applied to wire bonded ball grid array (BGA) IC and the modelling methodology is validated with test structures. The measurement set ups to calculate the radiated emission from reference antenna structures as well as from the real IC are used.…”
Section: Review On Various Methodologies Used In Recent Work To Predict Emimentioning
confidence: 99%
“…All the simulations as well as the IC stripline structure are simulated using 3D EM solver. Hwang et al [47] has followed the methodology but improvised model proposed in [48] Heuvelman et al [49] this concept is extended and applied to wire bonded ball grid array (BGA) IC and the modelling methodology is validated with test structures. The measurement set ups to calculate the radiated emission from reference antenna structures as well as from the real IC are used.…”
Section: Review On Various Methodologies Used In Recent Work To Predict Emimentioning
confidence: 99%