Epoxy resins VIII. Thermal properties of 4,4′‐sulfonyldiphenol and bisphenol a epoxy resins

Abstract

Epoxy resins of different molecular weights were prepared from epichlorohydrin and 4,4'-sulfonyldiphenol (SDP) and from epichlorohydrin and bisphenol A (BA). They were cured at high temperatures with four different crosslinking agents, including aliphatic and aromatic amines. The thermal behaviour of these cured epoxy resins was studied. From the IPDT and IDT data it was observed that sulfone epoxy resins were thermally more stable than bisphenol A epoxy resins. The activation energies of thermal degradation of the resins were calculated and the implications of these results are discussed. ZUSAMMENFASSUNG :Es wurden Epoxidharze mit unterschiedlichen Molekulargewichten aus Epichlorhydrin und 4,4'-Sulfonyldiphenol (SDP) und aus Epichlorhydrin und Bisphenol A (BA) hergestellt . Sie wurden bei hohen Temperaturen mit vier verschiedenen Vernetzern, einschlieBlich aliphatischer und aromatischer Amine, gehktet. Das thermische Verhalten dieser geharteten Epoxidharze wurde untersucht. Aus den Zersetzungstemperaturen wurde entnommen, dalj Sulfon-Epoxidharze thermisch stabiler als Bisphe-no1 A-Epoxidharze sind. Die Aktivierungsenergien des thermischen Abbaus dieser Harze wurden berechnet, und die Folgerungen aus diesen Ergebnissen werden diskutiert .

Cure and glass transition temperature of the bisphenol S epoxy resin with 4,4?-diaminodiphenylmethane

“…Bisphenol A epoxy resin (BPAER) is widely employed as polymeric materials, as polymer matrices for composite material, and as adhesives. The improved epoxy resin based on bisphenol S (BPSER) is considered worthy of further study in terms of its good thermal stability, chemical resistance, mechanical properties, and modification because of the introduction of sulfonyl groups into the backbone of the resins 3, 4. The cure process and thermal properties of this thermosetting material affect its macroscopic properties, which govern its end‐use performance.…”

Comparative studies on the curing kinetics and thermal stability of tetrafunctional epoxy resins using various amines as curing agents

“…The greater stability of the DDS cured resin may be ascribed to a greater heat resistance character of the sulphur linkage compared with those of carbon [17]. The lowest stability observed in case of DETA cured resin systems is due to a purely aliphatic structure of DETA in the cured product.…”

“…The curing agents DDM and DDS gave relatively more stable cured resins because of the thermally stable linkages present within the aromatic nuclei [16,17]. The greater stability of the DDS cured resin may be ascribed to a greater heat resistance character of the sulphur linkage compared with those of carbon [17].…”

Glass fiber-reinforced composites of diglycidyl ether of 2,7-dihydroxy naphthalene

“…This may be ascribed to the greater heat resistance character of the sulphur linkage, referring to a carbon linkage. 10 The nature of some selected thermograms are shown in Figure 3. They were found to proceed in two steps.…”