Epoxy networks possessing polyoxyethylene unites and loaded by Jeffamine-modified graphene oxide nanoplatelets

Omidi-Ghallemohamadi, Mehrdad; Ahmadi-khaneghah, Aziz; Behniafar, Hossein

doi:10.1016/j.porgcoat.2019.05.014

Cited by 12 publications

(3 citation statements)

References 29 publications

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“…In our recent studies, Jeffamine D-230 and 3-aminopropyltriethoxysilane were used for amine-functionalization of graphene oxide nanoflakes and silica nanospheres, respectively. 23,24 The functionalized nanofillers were then used in polyoxyalkylene-containing binary epoxy-amine systems. Various kinds of polyoxyalkylene segments such as polyoxybuthylene and polyoxyethylene can cause more flexibility in the epoxy thermoset films.…”

Section: Introductionmentioning

confidence: 99%

Binary Resin-Curing Agent Systems for Fabricating Epoxy and Graphene Oxide-loaded Epoxy Films

Ahmadi-khaneghah

Khosravi-ardakani

Jahani

et al. 2023

High Performance Polymers

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In this research, diglycidyl ethers of bisphenol-A (BADGE) and polyethylene glycol (PEGDGE) were binarily cured with a mixture of diamine curing agents including isophorone diamine and polyethylene glycol diamine (PEGDA) in the absence/presence of aminated graphene oxide nanoplatelets (AGNPs, 0.5 wt.%). Four molar ratios of diglycidyl ethers and curing agents were used stoichiometrically in isothermal curing systems. The films prepared from the epoxy networks were entirely strong and pliable. All epoxy thermosets were evaluated using field emission-scanning electron microscopy (FE-SEM), Fourier transform infrared (FT-IR) spectroscopy, X-ray diffraction (XRD), and diffuse reflectance-ultraviolet/visible spectroscopy (DR-UV/vis). The absorption coefficients of the epoxy and AGNPs-loaded epoxy materials decreased with increasing the molar ratio of PEGDGE resin and polyethylene glycol diamine curing agent. According to dynamic mechanical analysis no phase heterogeneity occurred in the structure of the prepared thermostats. When the thermoset materials were loaded by AGNPs filler, the peaks associated with alpha relaxations shifted to higher temperatures. Moreover, thermogravimetric analysis demonstrated that the thermal stability of the prepared epoxy thermosets slightly increased after the addition of the nanoplatelets. In addition, the thermal resistance of the prepared thermosets decreased to some extent by increasing the participation rate of monomers containing polyoxyethylene.

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Section: Introductionmentioning

confidence: 99%

Binary Resin-Curing Agent Systems for Fabricating Epoxy and Graphene Oxide-loaded Epoxy Films

Ahmadi-khaneghah

Khosravi-ardakani

Jahani

et al. 2023

High Performance Polymers

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“…For example, various kinds of Jeffamines, amine‐terminated polyoxypropylenes, were used to toughen epoxy thermosets 10–15 . For this purpose, some epoxy resins like diglycidyl ethers of polyethylene glycol (PEG) and polypropylene glycol were also investigated 16–20 . Employing polyoxyalkylene‐containing monomers, however, reduces the mechanical strength of the resulting cured material.…”

Section: Introductionmentioning

confidence: 99%

“…[10][11][12][13][14][15] For this purpose, some epoxy resins like diglycidyl ethers of polyethylene glycol (PEG) and polypropylene glycol were also investigated. [16][17][18][19][20] Employing polyoxyalkylenecontaining monomers, however, reduces the mechanical strength of the resulting cured material. When these monomers are stoichiometrically used, some mechanical and thermomechanical behaviors of the thermoset obtained weaken due to the excessive presence of their flexible segments.…”

Section: Introductionmentioning

confidence: 99%

Simultaneously cured diglycidyl ethers of bisphenol A and polyethylene glycol: DSC, TGA, and DMA measurements

Ghallemohamadi,

Heydari,

Jahani

et al. 2023

Polymers for Advanced Techs

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In this study, to improve the physico‐mechanical properties of epoxy thermosets, simultaneous curing of two resins with a stoichiometric amount of an aromatic amine hardener was investigated. The two resins used included the well‐known diglycidyl ether of bisphenol A (DGEBPA) with relatively rigid molecular structure and a diglycidyl ether derived from a popular polymer, polyethylene glycol (PEG), with loose molecular structure (DGEPEG). DGEPEG was used in amounts of 10 and 25 mol% in the resin mixture. A single‐resin curing process, including only DGEBA, was also examined. Before isothermal curing, differential scanning calorimetry (DSC) was used to determine the position of the curing exotherm. To ensure the completion of the curing processes, infra‐red (IR) and DSC techniques were performed on both simultaneously‐cured thermosets and the control thermoset. The thermogravimetric analysis (TGA) of the prepared thermosets showed that the addition of DGEPEG resin in the curing process of DGEBA resin has no significant effect on reducing the thermal resistance of the thermoset. In addition, the storage moduli (E′) and the damping coefficients (tan δ) were measured by dynamic mechanical analysis (DMA). As the mole percentage of DGEPEG resin increased, the rapid drop in the E′ value and the α‐relaxation, which is a measure of the glass transition (Tg), occurred at lower temperatures.

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Polyurethane elastomer–silica hybrid films based on oxytetramethylene soft segments: thermal and thermo-mechanical investigations

2021

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Epoxy networks possessing polyoxyethylene unites and loaded by Jeffamine-modified graphene oxide nanoplatelets

Cited by 12 publications

References 29 publications

Binary Resin-Curing Agent Systems for Fabricating Epoxy and Graphene Oxide-loaded Epoxy Films

Binary Resin-Curing Agent Systems for Fabricating Epoxy and Graphene Oxide-loaded Epoxy Films

Simultaneously cured diglycidyl ethers of bisphenol A and polyethylene glycol: DSC, TGA, and DMA measurements

Polyurethane elastomer–silica hybrid films based on oxytetramethylene soft segments: thermal and thermo-mechanical investigations

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