Epoxy Nanocomposites with Reduced Graphene Oxide-Constructed Three-Dimensional Networks of Single Wall Carbon Nanotube for Enhanced Thermal Management Capability with Low Filler Loading

Abstract

Thermal management materials are solutions to heat dissipation issues in electronic devices, which are key to the device reliability and lifetime. Epoxy-based materials have been widely used but suffer from their intrinsically low thermal conductivity. In this work, we employ the combined hydrothermal reduction, ice-templated assembly, and vacuum-assisted infiltration methods to construct well-aligned rigid three-dimensional (3D) networks of reduced graphene oxide (RGO) walls bridged by (functional) single wall carbon nanotubes ((f)SWCNTs) in the epoxy resin. The 3D RGO/(f)SWCNT aerogel notably enhances thermal conductivity, reduces the coefficient of thermal expansion (CTE), and increases the glass-transition temperature (T g ) without deteriorating the electrical insulating property. Remarkably, the (RGO/fSWCNT) 1:2.5 epoxy nanocomposite reaches a thermal conductivity of 0.63 to 0.69 W m −1 K −1 from 300 to 390 K at a very low filler loading of 3.65 vol %, which is more than four times enhancement over the pure epoxy resin. The CTE decreases by 11.2 ppm K −1 and T g increases by 20 K. We also show that the functional groups associated with the 3D RGO/fSWCNT aerogel are beneficial for improvement in thermal conductivity, dimensional stability, and thermal stability. The epoxy nanocomposites reported by this work demonstrate strong potential for thermal management application in electronic packaging.

Mechanical performance and thermal stability of modified epoxy nanocomposite with low loading of graphene platelets

“…The addition of GNP increased the T g value for all the nanocomposites, with the highest T g value of 71°C achieved in the 0.4 wt% GNP sample, which was 12°C higher than that of neat epoxy/LENR. Similar increases in the T g were observed for the epoxy based nanocomposites with different types of modified graphenes 17,24,25 . The improved T g value is associated with the layered structure of graphene introduces a high disturbance to the cross‐linking mechanism by effectively constraining the molecular chain motion of the epoxy/LENR matrix 24,25 …”

“…Similar increases in the T g were observed for the epoxy based nanocomposites with different types of modified graphenes 17,24,25 . The improved T g value is associated with the layered structure of graphene introduces a high disturbance to the cross‐linking mechanism by effectively constraining the molecular chain motion of the epoxy/LENR matrix 24,25 …”

Preparation and Characterization of UV-LED Curable Acrylic Films Containing Biochar and/or Multiwalled Carbon Nanotubes: Effect of the Filler Loading on the Rheological, Thermal and Optical Properties

“…As the incorporation of micro-to-nano-fillers in photocurable systems has clearly demonstrated its suitability for designing novel materials with improved mechanical, thermal, electrical and barrier properties with respect to the unfilled counterparts, in this work we investigated the effects of the presence of two selected carbon materials, namely multiwalled carbon nanotubes (MWCNTs) and biochar, on the rheological, thermal and optical properties of epoxy-acrylate UV-LED curable systems. Indeed, the scientific literature clearly highlights the exploitability of 1-3D carbonaceous fillers in various fields, as they can approve the properties of a plethora of nanocomposites [14][15][16][17].…”

Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

“…The resultant composite displayed high through-plane thermal conductivity of 4.14 Wm −1 K −1 when the EG content is 0.91 vol%. Liang et al [ 50 ] built a CNTs-bridged reduced GO network by hydrothermal treatment, and then introduced it into epoxy resin through vacuum-assisted infiltration method to obtain electrical insulation composite with in-plane thermal conductivity of 0.69 Wm −1 K −1 . It is pointed out that the carbon-based aerogel with three-dimensional interconnected structure can greatly enhance the thermal conductivity of polymer composites under low load content.…”