2007
DOI: 10.1007/s10853-006-0547-0
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Epoxy-imide resins from N-(4-carboxyphenyl)trimellitimide: effect of imide and aromatic content on adhesive and thermal properties

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Cited by 7 publications
(4 citation statements)
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“…Fillers such as fibers (glass, carbon, and aramid) or particles such as ceramic powders usually have dimensions in the range of 1–10 or even more micrometers. They favorably harden the material and may also increase the strength under certain load conditions, but on the other hand yields unfavorable effects on important properties like the material's impact resistance . An innovative approach aiming to overcome this basic problem is related to the exploitation of nanotechnology and the employment of fillers in the nanometer scale.…”
Section: Introductionmentioning
confidence: 99%
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“…Fillers such as fibers (glass, carbon, and aramid) or particles such as ceramic powders usually have dimensions in the range of 1–10 or even more micrometers. They favorably harden the material and may also increase the strength under certain load conditions, but on the other hand yields unfavorable effects on important properties like the material's impact resistance . An innovative approach aiming to overcome this basic problem is related to the exploitation of nanotechnology and the employment of fillers in the nanometer scale.…”
Section: Introductionmentioning
confidence: 99%
“…The blending of epoxy with nanofillers enhances the fracture toughness. Thus epoxy nanocomposites show superior stiffness, specific strength, and low cure shrinkage . Nanocomposites embrace more than one solid phase, where at least one phase dimension is in the nanometer range, whether it is amorphous, semi‐crystalline or crystalline, should be in the range of 1–20 nm .…”
Section: Introductionmentioning
confidence: 99%
“…Some of the papers in this field analyze the thermal behavior of polymers or polymer composites . From our best information, it follows that the number of works of this type referring to polymer composites is much lower …”
Section: Introductionmentioning
confidence: 99%
“…Similarly, imide‐diacids, new compounds having concurrently rigid imide structure and reactive carboxyl acid, had shown a promising application in improving PU's thermal stability15 and modifying epoxy resin to improve thermal properties, mechanical properties 16–24. However, some of the drawbacks to the employment of these high performance compounds, especially diimide‐diacids, were their high melting temperatures and lower solubility in common solvent, correspondingly, an elevated reaction temperature was always needed, such as in addition reaction between carboxylic of diimide‐diacids and epoxy groups of epoxy resins including DGEBA and EPN.…”
Section: Introductionmentioning
confidence: 99%