1997
DOI: 10.1016/s0921-5107(96)02029-6
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Epitaxial lift-off GaAs solar cell from a reusable GaAs substrate

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Cited by 84 publications
(64 citation statements)
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“…The major drawback of this method arises from the high surface roughness of the substrate due to the prolonged exposure to the HF etchant in addition to residues left on the substrate after the ELO process. [ 6,7 ] This prevents the direct reuse of the wafers and additional chemical mechanical polishing is required for the repreparation of the substrate surface to achieve the epi-ready condition. In addition to involving additional fabrication costs, this method also consumes tens of micrometers of material from the top surface of the substrate, which limits the potential number of wafer reuses.…”
Section: Doi: 101002/aenm201400589mentioning
confidence: 99%
“…The major drawback of this method arises from the high surface roughness of the substrate due to the prolonged exposure to the HF etchant in addition to residues left on the substrate after the ELO process. [ 6,7 ] This prevents the direct reuse of the wafers and additional chemical mechanical polishing is required for the repreparation of the substrate surface to achieve the epi-ready condition. In addition to involving additional fabrication costs, this method also consumes tens of micrometers of material from the top surface of the substrate, which limits the potential number of wafer reuses.…”
Section: Doi: 101002/aenm201400589mentioning
confidence: 99%
“…The cell showed good open circuit voltage V oc and short circuit current J sc values, but a relatively low FF due to a high series resistance. In the same year, using the large area liftoff approach, research at Radboud University Nijmegen showed a thin-film cell that also had proper V oc and J sc values, but with an even lower FF [28,29]. The efficiency was around 10%, compared to 24% for a wafer based cell with a similar layer structure.…”
Section: Thin-film Iii-v Cell Developmentmentioning
confidence: 99%
“…New designs for cells with more than 3 junctions require the use of thin-film cells in some form [27,59,60] either as a free standing thin-film cell or in combination with cells grown on different wafer materials through a layer transfer process. A basic method for obtaining a thin-film cell by etching/polishing of the wafer after growth is widely used [1,28,29], but this is an expensive method because the wafer, which has a large contribution in the total cell cost, is lost. Epitaxial lift-off offers the possibility of wafer reuse and is more and more maturing after being under investigation for more than 20 years, resulting in good quality cells and a stable process.…”
Section: Future Perspectivesmentioning
confidence: 99%
“…The development of ELO was originally motivated by the need for cheaper substrates in the solar cell industry, since the original substrates can be re-used after the epilayer has been lifted o! [55,56]. The technique is also very promising for GaAs-on silicon optoelectronics [57] and the fabrication of e$cient light-emitting diodes [58].…”
Section: Epitaxial Lift-ow/substrate Removalmentioning
confidence: 99%