1998
DOI: 10.1039/a708233i
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Enzyme assay using ultra-low volume surface micromachined sensors

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Cited by 5 publications
(7 citation statements)
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References 11 publications
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“…Finally, in order to remove the polymide residue, the Ti sacri®cial layer was removed using a reactive ion etching (RIE) in 30 sccm pure oxygen at 20 mTorr and 100 W RF power for 3 min followed by 10 sccm SF6 at 13 mTorr and 100 W for 9 min. These methods proved more satisfactory than, and differ from our previously published methods, where we have used a wet etch for NiCr [9].…”
Section: Fabrication Using Polyimidecontrasting
confidence: 59%
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“…Finally, in order to remove the polymide residue, the Ti sacri®cial layer was removed using a reactive ion etching (RIE) in 30 sccm pure oxygen at 20 mTorr and 100 W RF power for 3 min followed by 10 sccm SF6 at 13 mTorr and 100 W for 9 min. These methods proved more satisfactory than, and differ from our previously published methods, where we have used a wet etch for NiCr [9].…”
Section: Fabrication Using Polyimidecontrasting
confidence: 59%
“…Schematic diagram of major fabrication steps: 1) Exposure of positive photoresist through a mask, in order to de®ne the template for microelectrode deposition; 2) development of exposed photoresist followed by; 3) evaporation of multilayers of metals to form the microsensor array; 4) lift off reveals the microsensor con®guration; (5) deposition of the negative photoresist (e.g., polyimide or SU-8) and exposure through a mask; 6) development of the exposed resist to reveal the microelectrodes within an analytical chamber. Postprocessing of the chambers may include a variety of wet or dry etches to remove residues, and or sacri®cial layers, and=or electrochemical or sputtered deposition of ad-layers, such as platinum (note bioelectrochemical experiments including the detection of hydrogen peroxide or the enzyme linked assay with glucose oxidase, involved the use of sputtered Pt on top of the Au surface, in order to reduce the required overpotential for detection [9]). 8 microchambers) multilayer structures.…”
Section: Electrodes Patternmentioning
confidence: 99%
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“…In a typical procedure, the first shadow mask was used to successively deposit a 20-nm thick titanium (Ti) layer, a 20-nm thick palladium (Pd) layer, and a 500-nm thick gold (Au) layer onto a glass substrate by electron beam deposition (Denton Vaccum, Moorestown, NJ, USA). The thicknesses of the Ti and Pd layers were chosen according to optimized parameters reported in the literature 52 . In this study 20-nm thickness of the Ti layer was selected to achieve the strong adhesion of the Au layer.…”
Section: Methodsmentioning
confidence: 99%