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2022
DOI: 10.1016/j.jclepro.2022.132898
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Environmentally friendly grinding of C/SiCs using carbon nanofluid minimum quantity lubrication technology

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Cited by 80 publications
(19 citation statements)
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“…For this reason, it was selected as the base oil. Similarly, graphene is a single-layer carbon-based layer with good thermal conductivity, which is much higher than other particles [15] . Table 1.…”
Section: Methodsmentioning
confidence: 99%
“…For this reason, it was selected as the base oil. Similarly, graphene is a single-layer carbon-based layer with good thermal conductivity, which is much higher than other particles [15] . Table 1.…”
Section: Methodsmentioning
confidence: 99%
“…Al 2 O 3 nanofluid application during grinding of titanium alloy (Ti-6Al-4V). Qu et al (2022) investigated the grinding performance of ceramic matrix composites using mono carbon nanofluid minimum quantity lubrication (CN-MQL) with carbon concentration (C) = 5 g/L and noticed lesser normal grinding force ( F n = 20.3 N) and a reduction in surface maximum height difference ( S z = 4.13 μm) under CN-MQL compared to 44.9 N and 8.44 μm for dry grinding conditions, respectively. Yang et al (2017) generated the maximum undeformed chip thickness ( DBh max -e ) model for the ductile-brittle transition using geometry and kinematics analyses in the grinding of zirconia ceramics (3Y-TZP).…”
Section: Minimum Quantity Lubrication Milling Drilling and Grinding U...mentioning
confidence: 99%
“…Al 2 O 3 nanofluid application during grinding of titanium alloy (Ti-6Al-4V). Qu et al (2022) investigated the grinding performance of ceramic matrix composites using mono carbon nanofluid minimum quantity lubrication (CN-MQL) with carbon concentration (C) ¼ 5 g/L and noticed lesser normal grinding force (F n ¼ 20.3 N) and a reduction in surface maximum height difference (S z ¼ 4.13 mm) 6, 57.8, 52.0, 50.7, 45.6, 39.7 and 32.4 during ultrasonic assisted grinding (UAG) of 100 Cr6 hardened steel (bearing steel) under the MQL system. The results showed that combining MQL and UAG reduces the maximum grinding temperature by up to 56.3% (from 254°C to 111°C) when compared with dry grinding conditions.…”
Section: Minimum Quantity Lubrication Milling Drilling and Grinding U...mentioning
confidence: 99%
“…Therefore, the ductile grinding mechanism, i.e. the characteristics of ductile deformation and removal of work materials during grinding, needs to be elucidated to optimize process parameters to achieve highefficiency and high surface integrity machining of hard and brittle materials [26][27][28][29]. Tao et al [30] carried out scratching tests and transmission electron microscopy (TEM) to elucidate the mechanism of ductile damage in silicon wafers.…”
Section: Introductionmentioning
confidence: 99%