Environmental Evaluation of LTCC Flip-Chip and Surface Mount Technology for Satellite Applications

Abstract

Anenvironmental qualification of ahybrid technology for satellite applications is presented. It is based on low temperature co-fired ceramic modules attached in asurface mount technology to amother board on an aluminum base plate. For the module assembly flip-chip mounting using ultrasonic and thermocompression bonding is considered. As avalidation the circuits are exposed to numerous mechanical and thermal testing procedures. In three qualification steps the different manufacturingmethods are evaluated and discussed.