Entropy Production-Based Full-Chip Fatigue Analysis: From Theory to Mobile Applications

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

“…which agrees with Onsager's principle of irreversible processes [33]. Sharifah et al analyzed irreversible thermal migration and electromigration by applying the entropy generation to characterize damage mechanics through a damage parameter (Equations (14)):…”

“…Entropy generation analysis indicated that the TSV structure was easily influenced on the pad corner than on the pad center under thermal cycles and that a sharp increase in entropy generation at both ends of a diagonal implied a possible crack [15]. The running lifetime of seven central processing unit applications of an Android mobile phone was analyzed in the same way [14].…”

“…Wang et al [14] Through-silicon via (TSV) mobile applications -Fatigue analysis and prediction of TSV without any fitting data were studied.…”

“…Fatigue is an important indicator of the reliability of mechanical components, including microscopic TSV structures [14] and macroscopic parts of aviation Al [17]. The theory of entropy generation is involved in the diagnosis of the defects of mechanical components and in the subsequent assessment of the reliability of mechanical structures.…”

“…Second, entropy generation on mechanical structures is considered in several defect cases. The destructive stress in critical microstructures can also be predicted with the analysis of entropy generation [14,15]. In addition, structural fatigue and failure in microscopic or macroscopic objectives can be effectively characterized by entropy analysis.…”